| Time | Topics | Speakers | 
|---|
| 10:00 – 10:03  | Welcome by the moderator  | Robert Wu, Sales Representative, PHIX Photonics Assembly | 
| 10:03 – 10:05  | Pre-recorded welcoming  | Carlos Lee, Director General, EPIC – European Photonics Industry Consortium | 
| 10:05 – 10:15  | Welcoming address | Jackson J. Rothe, Founder, Managing Director, SINOLUMINA | 
| 10:15 - 10:30 | New Products for Hyperscale Customers  | Tom William, Senior Analyst, LightCounting Market Research | 
| 10:30 – 10: 45 | The WDM Component Characterisation Challenge | Peter Chan, Vice President of APAC Business Development, Santec | 
| 10:45 – 11:00 | AuSn Thin Film Technology and AuSn Pre-deposited Substrates for Optoelectronics | Allen Liu, Product Line Manager Diode Laser BU, Focuslight Technologies | 
| 11:00 – 11:15 | 3D Maskless lithography by two-photon polymerization for optical packaging  | Peter Han, Sales Engineer, Nanoscribe | 
| 11:15 – 11:30 | Lithography and Etching based Micro Optic  | Cynthia Zhao, Business Development Director, Axetris | 
| 11:30 – 11:45 | Challenge on fiber interconnect for CPO | John Lu, Product Manager, Senko Advanced Components | 
| 11:45 – 12:00 | (Hybrid) PIC packaging and the volume scale up | Robert Wu, Sales Representative, PHIX Photonics Assembly | 
| 12:00 | Closing address  | Robert Wu, Sales Representative, PHIX Photonics Assembly |