` China international Optoelectronic Exposition Conference (CIOEC)

Wafer-level Lens & Camera Module Technology Progress and Application Seminar

Date:September 10, PM. 2020
Venue:Media Center B, Shenzhen World Exhibition and Convention Center

Organizer

The committee of Optical Manufacturing Technologies, The Chinese Optical Society

China International Optoelectronic Exposition

China as the global optical lens processing and manufacturing base, how to respond to changes in market demand during the rapid growth of optical imaging technology, Europe's optical technology and development status, global optical lens market demand, the transformation and improvement of wafer-level lens module technology in design, production and manufacturing are all hotspots of our concern.

we will focus on the production and technical development of wafer-level optical lens modules and wafer-level optical components, the status of European photonics image processing and measurement technology and the direction of market demand and, combined with the application of related technologies, optical industry experts and senior executives of well-known enterprises from China and Europe are invited to discuss and analyze in depth with senior executives, technicians and market personnel from optical industries.

中国国际光电高峰论坛(CIOEC)

Agenda

晶圆级镜头模组的技术进展及应用研讨会

*请左右滑动查看完整会议一览表

Times Topics Speakers & Companies
9:55-10:00 Host Xudong Wu, Market Director, Sunny Opotech Co., Ltd.
10:00-10:20 The Application of Nano Wafer Level Optics in WLO (Wafer Level Optics) Li Gong,General Manager,Suss Trade Co., Ltd.
10:20-10:40 Application of Visualization Technology in Manufacturing Process of Optical Glass Materials Naishuai Wang, Deputy Director of Technology Center, CDGM Glass CO., Ltd.
10:40-11:05 Future development of optical imaging products on mobile terminal products Xudong Wu, Market Director, Sunny Opotech Co., Ltd.
11:05-11:30 Key Technology and Future of Lensless Imaging for Mobile Phones Professor Qi Li, Zhejiang University
11:30-11:55 Micro - Nano Optics and 3D sensing Kehan Tian,Beijing Yuguang Science and Technology Development Co., Ltd
12:00-13:30 Lunch Break None
13:25-13:30 Host Jian Bai, Zhejiang University
13:30-13:55 Life and Death in the Hands of Camera Mr. Au Po Lam, Assistant Vice President – CIS,ASM
13:55-14:15 3D Structure Light Module for Payment & Smart door lock Application Kyo,Product Manager,Himax Technologies Inc
14:15-14:40 Development and challenge of imaging optics engineering in terminal field Jakey Tsin, Huawei Technologies CO., LTD
14:40-15:00 Advanced Optical Coating Materials GRINM Resources and Environment Tech., Ltd.
15:00-15:15 Tea break
15:15-15:40 Development and Functional Expansion on Image Sensor Neil Jin,Sr. Product Marketing Manager, OmniVision Technologies, Inc.
15:40-16:05 Development of Computational Optics System Bo Yang, University of Shanghai for Science and Technology,GM,NOVA-OPTICS
16:05-16:25 Wafer Level Lens Molding Technology Trend and Application Danny Mao,China region sales manager

Agenda

Wafer-level Lens & Camera Module Technology Progress and Application Seminar
Times Topics Speakers & Companies
9:55-10:00 Host Xudong Wu, Market Director, Sunny Opotech Co., Ltd.
10:00-10:20 The Application of Nano Wafer Level Optics in WLO (Wafer Level Optics) Li Gong,General Manager,Suss Trade Co., Ltd.
10:20-10:40 Application of Visualization Technology in Manufacturing Process of Optical Glass Materials Naishuai Wang, Deputy Director of Technology Center, CDGM Glass CO., Ltd.
10:40-11:05 Future development of optical imaging products on mobile terminal products Xudong Wu, Market Director, Sunny Opotech Co., Ltd.
11:05-11:30 Key Technology and Future of Lensless Imaging for Mobile Phones Professor Qi Li, Zhejiang University
11:30-11:55 Micro - Nano Optics and 3D sensing Kehan Tian,Beijing Yuguang Science and Technology Development Co., Ltd
12:00-13:30 Lunch Break None
13:25-13:30 Host Jian Bai, Zhejiang University
13:30-13:55 Life and Death in the Hands of Camera Mr. Au Po Lam, Assistant Vice President – CIS,ASM
13:55-14:15 3D Structure Light Module for Payment & Smart door lock Application Kyo,Product Manager,Himax Technologies Inc
14:15-14:40 Development and challenge of imaging optics engineering in terminal field Jakey Tsin, Huawei Technologies CO., LTD
14:40-15:00 Advanced Optical Coating Materials GRINM Resources and Environment Tech., Ltd.
15:00-15:15 Tea break
15:15-15:40 Development and Functional Expansion on Image Sensor Neil Jin,Sr. Product Marketing Manager, OmniVision Technologies, Inc.
15:40-16:05 Development of Computational Optics System Bo Yang, University of Shanghai for Science and Technology,GM,NOVA-OPTICS
16:05-16:25 Wafer Level Lens Molding Technology Trend and Application Danny Mao,China region sales manager

Guest Introduction

Registration process

Wafer-level Lens & Camera Module Technology Progress and Application Seminar

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Pls send email to contact us

Ms Fiona She;Tel:86-0755-88242564;Email: fiona.she@cioe.cn

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