| Time | Topics | Speakers |
|---|
| 13:30-13:40 | ePIXfab – The European Silicon Photonics Alliance; Welcome speech | Roel Baets, Professor at Ghent University; William Chen, ePIXfab China Liaison Officer |
| 13:40-14:00 | Enabling faster time-to-market by verification of Photonics Integrated Circuit design through all the design steps | Ruping Cao, General Manager, Luceda China |
| 14:00-14:20 | Low loss PICs: from prototype to volume | Can Yao, Application Engineer, LIGENTEC SA |
| 14:20-14:40 | TriPleX® Silicon nitride platform | Sami Musa, CEO, Chilas B.V |
| 14:40-15:00 | Mass transfer of lll-V photodiodes on silicon photonics platform – advantages, alternatives, and future perspective | Hektor Meier, Head of Product Development, Albis Optoelectronics |
|
| 15:10-15:30 | Advanced integrated photonics testing from wafer-level to single-die | Francois Couny, Solutions Manager, EXFO |
| 15:30-15:50 | A new breed of photonic ICs (PIC) for next-generation optical transceiver modules and optical I/O | Yannick Paillard, Chief Commercial Officer, SCINTIL Photonics |
| 15:50-16:10 | 3D Full-wave Simulation of mm-scale PIC Components | Tom Chen, Senior Photonics Engineer, Flex Compute |
| 16:10-16:30 | Co-packaged Photonics for next-gen AI/ML systems | Ashkan Seyedi, Principal Engineer, Nvidia |
|
