The 34th MEMS Seminar: 3D Vision Technology and Application(Finished)
- Time：PM, September 6, September 7
- Venue：6B, 2nd Floor, Hall 6
- Language：CN
- Host
- Wuxi MEMS Consulting Co., Ltd
- China International Optoelectronic Exposition
| Time | Topics | Speakers |
|---|---|---|
| Sept.6th Lidar technology and applications | ||
| 13:30-13:55 | Promote the Mass Production Application of LiDAR Modules with Optical Innovation | Jia Yang, Head of R&D in New Areas of Sunny Automotive Optech |
| 13:55~14:20 | High Performance LiDAR for Advanced Driving Assistance | Jieqiong Qin, R&D Director of Innovusion |
| 14:20~14:45 | Technology and Industrialization of Semiconductor Lasers for LiDAR | Jun Wang, Vice Chairman, Executive Deputy General Manager, and CTO of Suzhou Everbright Photonics Co ., Ltd |
| 14:45~15:10 | VCSEL Technology Development Helps Branded New Design of LiDAR | Qingwei Mo, Chief Scientist of Zhejiang Zjeagles Comsemi Technology Co., Ltd |
| 15:10~15:35 | Application of Silicon Optical Chip Based on Silicon Nitride in LiDAR | Jingwei Liu, Chairman and CEO of Guoke Optical Core |
| 15:35~16:00 | 2023 - Development of Core Optoelectronic Devices for Autonomous LiDAR | Jie Zhang, Head of Marketing Promotion of Hamamatsu China |
| 16:00~16:25 | Smart Light Sensing and Smart Car | Yang Liu, CEO of OPNOUS |
| 16:25~16:50 | Empowering the Automotive LiDAR Industry to Enter a Positive Cycle with China's Paradigm Chip Mass Production | Tao Xiong, Technology Director of Accelink Technologies Co., Ltd |
| 16:50~17:15 | Next Generation LiDAR and Photon Sensing Based on Silicon Optical Integrated Chip | Guanghua Yang, Co-founder and CTO of Inxun Technology Co., Ltd. |
| 17:15~17:30 | Silicon Photonic Integrated Circuit for FMCW LiDAR | Xiaoyong Yang, Head of Silicon Optical LiDAR Sensing at Intel |
| Sept.7th 3D sensing and imaging core technology | ||
| 9:30~10:00 | Check-in & Communication | |
| 10:00~10:25 | 3D Depth Sensor Commercial History Review and Future Prospects | Qiang Li, CEO of DAO Sensing |
| 10:25~10:50 | From Perception to Cognition, 3D Structured Light Cameras Can See the Physical World More Deeply | Zhe Cui, Vice President of Dilusense |
| 10:50~11:15 | Application of 3D Camera Based on MEMS Micromirror Chip Technology in Real Scenes | Lan Cai, Director of Strategic Planning of Wuxi V-Sensor Technology Co., Ltd |
| 11:15~11:40 | Mass Production and Application of Solid State Flash LiDAR | Feng Jin, Founder and CEO of Shanghai ToFFuture Technology Co., Ltd. |
| 11:40~12:05 | VCSEL Chip Test and Reliability Technology New Challenges - For LiDAR Applications | Wenxiu Zhang, R&D Director of Shanghai Feedlitech Co., Ltd |
| 12:05~13:30 | Lunch Time, Communication in Show Area | |
| 13:30~13:55 | What Are the Key Capabilities Required for 3D Vision to Create Robot Eyes | Lianghong Zhong, Head of Robotics Vision Product of ORBBEC |
| 13:55~14:20 | dToF Builds Digital Insight to Help Automotive and Consumer Sensing Complement Each Other | Kai Zang, Co-founder, Chairman, CEO of Shenzhen Adaps Photonics Technology Co., Ltd |
| 14:20~14:45 | Integrated Optical Fiber Light Source for LiDAR | Chuanwen Li, Founder and Chairman of LEANTOOL |
| 14:45~15:10 | 3D Vision +AI Single Chip Solution | Fan Zhou,Vice President of Yinniu Microelectronics (Wuxi) Co., Ltd. Liabilities |
| 15:10~15:35 | Discussion on Single Photon Technology and Industry Application of Various Routes | Wie Shen, Founder and Chief Scientist of Hangzhou Parity Microelectronics Technology Co., Ltd. |
| 15:35~16:00 | Full Stack Optical Chip Technology Enables Smart Sensing | Yan Xiao, CEO of LEMON Photonics Tech., Co., Ltd. |
| 16:00~16:25 | Light Field Regulation of High Power VCSEL | Jianwei Zhang, Researcher of Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences |
| 16:25~16:50 | Innovative Polarization 3D Technology and Industry Applications | Ruihua Chang, Chairman of Berxel photonics Co., Ltd |
| 16:50~17:15 | High Performance and High Integration 3D-ToF Driver Chip | Zhihong Lin, Product Line Director of PhotonIC Technologies |
| 17:15~17:30 | Post-meeting Exchange | |