Driven by the rapid advancement of AI computing power, advanced packaging, machine vision, and micro/nano optics manufacturing, Advanced Optics and Intelligent Sensing is ushering in new progress and opportunities in 2026. Wafer and package inspection, 3D AOI, spectral/interferometric/confocal metrology, deeplearningbased defect recognition, and the compactness and intelligent sensing capabilities enabled by metasurfaces are collectively driving the upgrade of manufacturing quality control and intelligent sensing systems.

Furthermore, the forum will explore current challenges, including microbump, warpage, hybrid bonding, and buried defect inspection in advanced packaging and heterogeneous integration; the balance between highresolution imaging and production throughput, false alarms, data labeling, and algorithm generalization; and the design and fabrication challenges of metasurface devices for 3D sensing, broadband imaging, and wearable displays. The forum will bring together perspectives from industry, academia, and application sectors to exchange ideas on inspection equipment, software algorithms, micro/nano optical devices, and system integration.