China International Optoelectronic Expo (CIOE) European Photonics Industry Consortium (EPIC)
EPIC is the largest photonics industry association in the world with more than 800 member companies. The EPIC TechWatch is composed of short presentation introducing the latest developments in optics and photonics.
Join us at the EPIC TechWatch at CIOE to explore the future of optics. This EPIC event brings together experts and leaders from the optics industry, showcasing groundbreaking technologies. Participate to learn more optics and photonics companies specialized in various aspects of this field, including the development and manufacturing of diode laser systems, photonic devices, optical filters, thin-film coatings, high-precision 3D printers for microfabrication, nanofabrication solutions, advanced materials for vacuum and photonic applications, and die bonding and dispensing solutions for photonic applications. These companies along the manufacturing value chain contribute to advancing photonic and optical technologies, playing crucial roles in the innovation and application of these technologies across multiple sectors.
Time | Topics | Speakers |
---|---|---|
14:00 – 14:05 | Welcoming by the moderators | Carlos Lee, Director General, EPIC – European Photonics Industry Consortium / Wanyin Cui, Wanyin Cui, General Manager, Nanoscribe China |
14:05 – 14:14 | AMO Wafer Stacking Technology | Richard Dong, AMO China Sales VP, Advanced Micro-optics Technologies |
14:14 – 14:23 | The "laser" the better our life | Chuanqi Ren, Product Manager, BWT |
14:23 – 14:32 | Adhesives for Silicon Photonics / Photonic Integrated Circuits (PIC) | Pan Li, Regional Sales Manager, DELO |
14:32 – 14:41 | In China for China: Edmund Optics’ Global Footprint and Localization Strategy | Corrine Lee, Engineering Manager, Edmund Optics |
14:41 – 14:50 | Test Design Kit (TDK) for General Wafer Level Testing of Photonic Devices | Beibei Wu, Senior Engineer, ETSC Technologies |
14:50 – 14:59 | PIC Wafer Level Test Requirements, Methods, and Challenges | Sun Xuerui, Application Engineer Manager - Great China, Korea&Japan, EXFO |
14:59 – 15:08 | ficonTEC Cutting Edge Technology of SiP Testing and Assembly for Now and Future | Alex Cao, General Manager, ficonTEC Service Shanghai |
15:08 – 15:17 | Transformative Diffractive Optics: Flat Lenses for Telecom and Pan-Semiconductor Applications | Hsiang-Chu Wang, Photonics System Engineer and Optical Designer, Focuslight Technologies |
15:17 – 15:26 | Multi-Functional Optical Filters for New-Gen Telecom Networks | Xiaolun Zeng, Product Group Manager, Iridian Spectral Technologies |
15:26 – 15:35 | Low loss Photonic Integrated Circuits (PICs): From Prototyping to Volume | Can Yao, Application Engineer, LIGENTEC |
15:35 – 15:44 | AI-Driven Innovation in Optoelectrical Packaging | Limin Zhou, General Manager, MRSI Automation |
15:44 – 15:53 | Recent Advances in Aligned Two-Photon Grayscale Lithography | Wanyin Cui, General Manager, Nanoscribe China |
15:53 – 16:02 | Metaoptics produced by Nanoimprint Lithography and Dry Etching | Martin Balimann, Head of Engineering and Head of Swiss Office, NIL Technology |
16:02 – 16:11 | Getter Technologies for Electronics and Optoelectronics Hermetic Packaging | Xianghua Meng, General Manager, SAES Getters |
16:11 – 16:20 | High brightness phosphor ceramics for laser projection | Lukas Liu, Technical Application Manager Advanced Optics Asia, SCHOTT |
16:20 – 16:29 | All wavelengths Toptica | Oliver Chen, Industry Market Sales, TOPTICA China |
16:29 – 16:38 | 980nm VCSEL & PD for automotive data communication | Kevin Lu, Sales & Marketing Director—APAC, TRUMPF (China) |
16:38 – 16:47 | Progress in optics for cost effective thermal imaging solutions | Dikai Niu, Optical Design Engineer, Umicore |
16:47 – 16:56 | Advanced Laser Optics Development in Wavelength OE | Li Linfeng, General Manager of Nanjing Wavelength Laser Division, Wavelength Opto-Electronic |
16:56 – 17:00 | Closing remarks by the moderators |