`
0to CIOE 2022 Opening Booth Application |
Organizer
HongKong Applied Science and Technology Research Institute
The International Optoelectronic Expo (CIOE)
Co-organizers
Shenzhen UBM Herong Exhibition Co., Ltd.
The state of art technologies and the trends of high-precision 2D/3D combined machine vision and the AI with self-learning capability will be discussed and further explored. This forum will try to facilitate the large-scale implementation and autonomy of semiconductor wafer packaging and inspection equipments. As a new technology, machine vision integrated with artificial intelligence will inevitably face major challenges. This forum also focus on the application prospects and potential developments of artificial intelligence in the field of machine vision, and discuss the development status, challenges and opportunities of intelligent machine vision technologies in the semiconductor wafer inspection.
Outline: 1. Share the development and application status of semiconductor wafer inspection technologies 2. Analyze the current challenges and opportunities in the semiconductor inspection 3. Discuss the application prospect and development direction of artificial intelligence (AI) and machine vision in the semiconductor inspection 4. Share the application of artificial intelligence and machine vision cases in semiconductor inspection and the state of art technologies
*请左右滑动查看完整会议一览表
Times | Topics | Speakers & Companies |
---|---|---|
Forum Chairman & Opening speech: Dr. Jiang Jinbo, Senior Manager, IoT Sensing & AI, ASTRI | ||
Host: Aaron He, Mainland Strategy Manager, ASTRI | ||
14:05 -14:30 | Collection and accuracy analysis of 3D point cloud of solder ball on wafer | Juntao Deng, Senior Optical Engineer, Wuhan Jingce Electronic Group Co., Ltd. |
14:30 -14:55 | AI Machine Vision in VR/AR lens cosmetic defect inspection | Dr. Willman Zou, Chief Technology Officer, Prevision Technology Limited |
14:55 -15:20 | AI Empowered Semiconductors, New Dimension of Business Model | Mr. Jack, YU XIAOFENG, Marketing Director, Matrixtime Robotics.,Ltd. |
15:20 -15:45 | Precision aerostatic stage for wafer inspection | Prof. Du Jianjun, Harbin Institute of Technology, Shenzhen |
15:45 -16:10 | Trends in spectroscopic ellipsometry (SE) characterization for semiconductor architectures | Associate Prof. Juan Antonio Zapien, City University of Hong Kong |
16:10 -16:35 | Application of artificial intelligence and machine vision in semiconductor inspection | Dr. Jiang Jinbo, Senior Manager, Technology Division of IoT Sensing & AI, ASTRI |
Times | Topics | Invited guests |
---|---|---|
Forum Chairman & Opening speech: Dr. Jiang Jinbo, Senior Manager, IoT Sensing & AI, ASTRI | ||
Host: Aaron He, Mainland Strategy Manager, ASTRI | ||
14:05 -14:30 | Collection and accuracy analysis of 3D point cloud of solder ball on wafer | Juntao Deng, Senior Optical Engineer, Wuhan Jingce Electronic Group Co., Ltd. |
14:30 -14:55 | AI Machine Vision in VR/AR lens cosmetic defect inspection | Dr. Willman Zou, Chief Technology Officer, Prevision Technology Limited |
14:55 -15:20 | AI Empowered Semiconductors, New Dimension of Business Model | Mr. Jack, YU XIAOFENG, Marketing Director, Matrixtime Robotics.,Ltd. |
15:20 -15:45 | Precision aerostatic stage for wafer inspection | Prof. Du Jianjun, Harbin Institute of Technology, Shenzhen |
15:45 -16:10 | Trends in spectroscopic ellipsometry (SE) characterization for semiconductor architectures | Associate Prof. Juan Antonio Zapien, City University of Hong Kong |
16:10 -16:35 | Application of artificial intelligence and machine vision in semiconductor inspection | Dr. Jiang Jinbo, Senior Manager, Technology Division of IoT Sensing & AI, ASTRI |
*In no particular order
Official Wechat