` China international Optoelectronic Exposition Conference (CIOEC)

Applications and Prospects of Artificial Intelligence (AI) and Machine Learning in Semiconductor

Date:TBD
Venue:TBD

Organizer

HongKong Applied Science and Technology Research Institute

The International Optoelectronic Expo (CIOE)

Co-organizers

Shenzhen UBM Herong Exhibition Co., Ltd.

The state of art technologies and the trends of high-precision 2D/3D combined machine vision and the AI with self-learning capability will be discussed and further explored. This forum will try to facilitate the large-scale implementation and autonomy of semiconductor wafer packaging and inspection equipments. As a new technology, machine vision integrated with artificial intelligence will inevitably face major challenges. This forum also focus on the application prospects and potential developments of artificial intelligence in the field of machine vision, and discuss the development status, challenges and opportunities of intelligent machine vision technologies in the semiconductor wafer inspection.

Outline: 1. Share the development and application status of semiconductor wafer inspection technologies 2. Analyze the current challenges and opportunities in the semiconductor inspection 3. Discuss the application prospect and development direction of artificial intelligence (AI) and machine vision in the semiconductor inspection 4. Share the application of artificial intelligence and machine vision cases in semiconductor inspection and the state of art technologies

中国国际光电高峰论坛(CIOEC)

Agenda

机器视觉与人工智能在半导体检测方面的应用

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Times Topics Speakers & Companies
Forum Chairman & Opening speech: Dr. Jiang Jinbo, Senior Manager, IoT Sensing & AI, ASTRI
Host: Aaron He, Mainland Strategy Manager, ASTRI
14:05 -14:30 Collection and accuracy analysis of 3D point cloud of solder ball on wafer Juntao Deng, Senior Optical Engineer, Wuhan Jingce Electronic Group Co., Ltd.
14:30 -14:55 AI Machine Vision in VR/AR lens cosmetic defect inspection Dr. Willman Zou, Chief Technology Officer, Prevision Technology Limited
14:55 -15:20 AI Empowered Semiconductors, New Dimension of Business Model Mr. Jack, YU XIAOFENG, Marketing Director, Matrixtime Robotics.,Ltd.
15:20 -15:45 Precision aerostatic stage for wafer inspection Prof. Du Jianjun, Harbin Institute of Technology, Shenzhen
15:45 -16:10 Trends in spectroscopic ellipsometry (SE) characterization for semiconductor architectures Associate Prof. Juan Antonio Zapien, City University of Hong Kong
16:10 -16:35 Application of artificial intelligence and machine vision in semiconductor inspection Dr. Jiang Jinbo, Senior Manager, Technology Division of IoT Sensing & AI, ASTRI

Agenda

Applications and Prospects of Artificial Intelligence (AI) and Machine Learning in Semiconductor
Times Topics Invited guests
Forum Chairman & Opening speech: Dr. Jiang Jinbo, Senior Manager, IoT Sensing & AI, ASTRI
Host: Aaron He, Mainland Strategy Manager, ASTRI
14:05 -14:30 Collection and accuracy analysis of 3D point cloud of solder ball on wafer Juntao Deng, Senior Optical Engineer, Wuhan Jingce Electronic Group Co., Ltd.
14:30 -14:55 AI Machine Vision in VR/AR lens cosmetic defect inspection Dr. Willman Zou, Chief Technology Officer, Prevision Technology Limited
14:55 -15:20 AI Empowered Semiconductors, New Dimension of Business Model Mr. Jack, YU XIAOFENG, Marketing Director, Matrixtime Robotics.,Ltd.
15:20 -15:45 Precision aerostatic stage for wafer inspection Prof. Du Jianjun, Harbin Institute of Technology, Shenzhen
15:45 -16:10 Trends in spectroscopic ellipsometry (SE) characterization for semiconductor architectures Associate Prof. Juan Antonio Zapien, City University of Hong Kong
16:10 -16:35 Application of artificial intelligence and machine vision in semiconductor inspection Dr. Jiang Jinbo, Senior Manager, Technology Division of IoT Sensing & AI, ASTRI

Guest Introduction

*In no particular order

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