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2019 Data Center Optical-Electric Technology and Industry Summit（Finished）
Time：September 4-6, 2019
Venue：Shenzhen Convention & Exhibition Center
Language：
CIOE ,HUAWEI, Baidu and Tencent invite AcceLink、AOI、BROADEX TECHNOLOGIES、CZT、FINISAR、Hisense Broadband、Hisilicon、Inphi、Leoni、LightCounting、Luxshare、SourcePhotonics、Tri-light Wuhan Electronics Technology、Yamaichi Electronics to discuss data center development trend of optical interconnection and other hot frontier topics.

Conference agenda

2019 Data Center Optical-Electric Technology and Industry Summit（Finished）
TimeTopicsSpeakers
13:45-14:00Welcome & RegistrationSpeakers and Attendees Check-in
14:00-14:10Opening SpeechSwift Liu President of Data Communication R&D Department，Huawei
14:10-14:30Industry Report: Impact of Cloud Datacenters on the market for optical components, modules and transport equipmentVladimir Kozlov Founder and CEO of Light Counting
14:30-14:50Industry Report: Optical Interconnection Technologies and Requirements for Next Generation Data CenterSun Min, Optical Interconnection Architect of Data Center of Tencent
14:50-15:10Industry Report: Market Insight of Next Generation Data Center Network and Optical ModulesGang Chen Senior System Architecture，Baidu. Leader of Edge Computing working group at ODCC; Vice Leader of network working group at ODCC.
15:30-15:50Tea break & Guest Photos
15:50-16:10Industry Report：Small Size Requirements and technologies for Optical-Electric Module in Data Center.Lu Cao Senior System Engineer of Switch & Enterprise Gateway Design Dept., Huawei
16:10-16:30Industry Report: Short-distance high-speed optical transmission requirements and technical challengesYibo Liang Director of Opto-Electronics Product Management Dept., Hisilicon
16:30-16:50Industry Report: SFP size Next Generation Standard Platform Reachable 112G BAUDToshiyasu ITO Principal Engineer High Speed Connector Development of Yamaichi Electronics Co., Ltd.
16:50-17:10Industry Report: The Evolution of Transceiver Form Factor for Next Generation High Speed Data Center ApplicationDavid Chen AVP, Sales & Marketing, Strategic Marketing & Standard Office for Transceiver
17:10-17:30Industry Report: The trend and outlook of small form factor high speed cable assemblyFrank Jakobs Head of Research and Development Business Unit Telecommunication Systems of Leoni Special Cable
17:30-17:50NG SFP Announcement All Promotors
17:50-18:00Closing SpeechSonny Wang Vice president of Data Communication Production Line, Huawei President of Data Communication Strategy and Business development Dept.

2019 Other Information Communication Industry Forum

5G + Industry + New Generation Information Technology Forum（Finished）Optoelectronic Integration and Chips（Finished）
Optoelectronic Devices and Applications（Finished）Optical Broadband Access and Intelligent Industry Integration Development（Finished）
New Technologies, New Applications and New formats of Optical Networks（Finished）“Digital China” and Next Generation Data Center Optical Interconnection Technical Forum（Finished）
China Mobile “Towards Cloud vOLT, Leading the Gigabit New Era " Forum（Finished）China Telecom - Development and Application Forum of Optical Access Network in Gigabit Network era（Finished）