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2019 Data Center Optical-Electric Technology and Industry Summit(Finished)
Time:September 4-6, 2019
Site:Shenzhen Convention & Exhibition Center
Language:
CIOE ,HUAWEI, Baidu and Tencent invite AcceLink、AOI、BROADEX TECHNOLOGIES、CZT、FINISAR、Hisense Broadband、Hisilicon、Inphi、Leoni、LightCounting、Luxshare、SourcePhotonics、Tri-light Wuhan Electronics Technology、Yamaichi Electronics to discuss data center development trend of optical interconnection and other hot frontier topics.

Conference agenda

2019 Data Center Optical-Electric Technology and Industry Summit(Finished)
TimeTopicsSpeakers
13:45-14:00Welcome & RegistrationSpeakers and Attendees Check-in
14:00-14:10Opening SpeechSwift Liu President of Data Communication R&D Department,Huawei
14:10-14:30Industry Report: Impact of Cloud Datacenters on the market for optical components, modules and transport equipmentVladimir Kozlov Founder and CEO of Light Counting
14:30-14:50Industry Report: Optical Interconnection Technologies and Requirements for Next Generation Data CenterSun Min, Optical Interconnection Architect of Data Center of Tencent
14:50-15:10Industry Report: Market Insight of Next Generation Data Center Network and Optical ModulesGang Chen Senior System Architecture,Baidu. Leader of Edge Computing working group at ODCC; Vice Leader of network working group at ODCC.
15:30-15:50Tea break & Guest Photos
15:50-16:10Industry Report:Small Size Requirements and technologies for Optical-Electric Module in Data Center.Lu Cao Senior System Engineer of Switch & Enterprise Gateway Design Dept., Huawei
16:10-16:30Industry Report: Short-distance high-speed optical transmission requirements and technical challengesYibo Liang Director of Opto-Electronics Product Management Dept., Hisilicon
16:30-16:50Industry Report: SFP size Next Generation Standard Platform Reachable 112G BAUDToshiyasu ITO Principal Engineer High Speed Connector Development of Yamaichi Electronics Co., Ltd.
16:50-17:10Industry Report: The Evolution of Transceiver Form Factor for Next Generation High Speed Data Center ApplicationDavid Chen AVP, Sales & Marketing, Strategic Marketing & Standard Office for Transceiver
17:10-17:30Industry Report: The trend and outlook of small form factor high speed cable assemblyFrank Jakobs Head of Research and Development Business Unit Telecommunication Systems of Leoni Special Cable
17:30-17:50NG SFP Announcement All Promotors
17:50-18:00Closing SpeechSonny Wang Vice president of Data Communication Production Line, Huawei President of Data Communication Strategy and Business development Dept.

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