CIOE 2025 | The 26th China International Optoelectronic Expo || Shenzhen World

Time	Topics	Speakers
13:30-13:40	ePIXfab – The European Silicon Photonics Alliance; Welcome speech	Roel Baets, Professor at Ghent University; William Chen, ePIXfab China Liaison Officer
13:40-14:00	Enabling faster time-to-market by verification of Photonics Integrated Circuit design through all the design steps	Ruping Cao, General Manager, Luceda China
14:00-14:20	Low loss PICs: from prototype to volume	Can Yao, Application Engineer, LIGENTEC SA
14:20-14:40	TriPleX® Silicon nitride platform	Sami Musa, CEO, Chilas B.V
14:40-15:00	Mass transfer of lll-V photodiodes on silicon photonics platform – advantages, alternatives, and future perspective	Hektor Meier, Head of Product Development, Albis Optoelectronics

15:10-15:30	Advanced integrated photonics testing from wafer-level to single-die	Francois Couny, Solutions Manager, EXFO
15:30-15:50	A new breed of photonic ICs (PIC) for next-generation optical transceiver modules and optical I/O	Yannick Paillard, Chief Commercial Officer, SCINTIL Photonics
15:50-16:10	3D Full-wave Simulation of mm-scale PIC Components	Tom Chen, Senior Photonics Engineer, Flex Compute
16:10-16:30	Co-packaged Photonics for next-gen AI/ML systems	Ashkan Seyedi, Principal Engineer, Nvidia

Time

Topics

Speakers

13:30-13:40

ePIXfab – The European Silicon Photonics Alliance; Welcome speech

Roel Baets, Professor at Ghent University; William Chen, ePIXfab China Liaison Officer

13:40-14:00

Enabling faster time-to-market by verification of Photonics Integrated Circuit design through all the design steps

Ruping Cao, General Manager, Luceda China

14:00-14:20

Low loss PICs: from prototype to volume

Can Yao, Application Engineer, LIGENTEC SA

14:20-14:40

TriPleX® Silicon nitride platform

Sami Musa, CEO, Chilas B.V

14:40-15:00

Mass transfer of lll-V photodiodes on silicon photonics platform – advantages, alternatives, and future perspective

Hektor Meier, Head of Product Development, Albis Optoelectronics

15:10-15:30

Advanced integrated photonics testing from wafer-level to single-die

Francois Couny, Solutions Manager, EXFO

15:30-15:50

A new breed of photonic ICs (PIC) for next-generation optical transceiver modules and optical I/O

Yannick Paillard, Chief Commercial Officer, SCINTIL Photonics

15:50-16:10

3D Full-wave Simulation of mm-scale PIC Components

Tom Chen, Senior Photonics Engineer, Flex Compute

16:10-16:30

Co-packaged Photonics for next-gen AI/ML systems

Ashkan Seyedi, Principal Engineer, Nvidia

China International Optoelectronic Exposition (CIOE) is the world's largest exhibition in optoelectronic industry. It is the first as well as the most influential optoelectronic exhibition in China. The event is an annual gathering for the global optoelectronic professionals to gather around to network with business partners and discover the future trends. CIOE presents an entire optoelectronic industry chain. It is a meeting place where you could meet the people from every corner of optoelectronics fields including optical communications, lasers, semiconductors, infrared Imaging, precision optics, and photonics.
ePIXfab is a not-for-profit open alliance of academic and industrial organizations with a mission to promote silicon photonics science, technology and applications in Europe and the world. ePIXfab acts as a catalyst for European academia and industry to strengthen the worldwide silicon photonics ecosystem. ePIXfab promotes silicon photonics through advocacy of the latest developments in this field, by representing the silicon photonics community as a whole, through workforce development for industry and academia, by providing non-commercial consultancy, by liaising with overseas organizations, and by roadmapping the silicon photonics technological trends and evolutions.

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