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Integrated Circuit Measurement Technology and Instrument Forum(Finished)
Time:Sep 8, AM
Site:Conference Room, Hall 11
Co hosting
The International Optoelectronic Expo (CIOE)
Fudan University
Hong Kong Applied Science and Technology Research Institute
As the foundation and core of electronic information industry, integrated circuit industry is an important pillar and strategic industry of national economy and national defense. Wireless communication, artificial intelligence, automotive electronics, new sensors, and new displays drive the level of integrated circuit design to continue to improve, and bring greater challenges to integrated circuit testing. Due to the overall semiconductor equipment field there are high barriers to technology, capital and industrial collaboration. Compared with foreign enterprises, domestic enterprises entered the field late, and there is a big gap between the overall strength and scale of foreign competitors. However, after years of unremitting catch-up, the technical level of local enterprises has rapidly improved, testing and measurement equipment has grown from scratch, and domestic substitution is imperative.
In this context, CIOE will invite well-known enterprises, experts and scholars from upstream and downstream of the semiconductor testing industry chain to hold the "Integrated Circuit Measurement Technology and Instrument Forum" focusing on the fields of material characterization, nanometrics, defect detection, electrical testing, precision sensing, measurement standards and other fields in integrated circuit manufacturing. Carry out communication and discussion on the basic principles and methods of measurement and testing for integrated circuit manufacturing, key technologies and core devices, measurement standards and measurement technical specifications, measurement system integration and equipment development, etc., to solve the problem of "stuck neck" in the field of integrated circuit testing.
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Conference agenda

Integrated Circuit Measurement Technology and Instrument Forum(Finished)
TimeSpeech titleIntended Guests
10:05-10:25Application of nano probes for inspection and metrology in ICsShuming Yang, Professor, Dean, Xi’an Jiaotong University
10:25-10:45Discussion and Application of High-Precision Flexible Circuit Board Defect Detection TechnologyAnna Liu, Shenzhen Prevision Techonlogy Limited
10:45-11:05Research progress in optical inspection technology for integrated circuitsShuchun Huo, Vise Professor, The Institute of Microelectronics of the Chinese Academy of Sciences
11:05-11:25Research and application of innovative method of wafer appearance 3D measurement based on AINick Ou, Product Director, Wuhan jingce Elecronic Group Co.,LTD
11:25-11:45Current status and new principle of patterned wafer defect detectionJinlong Zhu, Professor, Huazhong University of Science and Technology
11:45-12:05Optical Inspection Technologies for Wafers and Integrated CircuitsZhouling Wu, Chief Scientist, ZC Optoelectronic Technologies, Ltd
12:05-12:25Semiconductor 3D metrologiesJinbo Jiang, Deputy Director, Hong Kong Applied Science and Technology Research Institute
HOST: Jiong Ma, Professor, Fudan University

Guest Introduction

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