Time | Topics | Speakers |
---|---|---|
HOST: Jiong Ma, Professor, Fudan University | ||
10:00-10:05 | Opening | Host |
10:05-10:25 | Application of nano probes for inspection and metrology in ICs | Shuming Yang, Professor, Dean, Xi’an Jiaotong University |
10:25-10:45 | Discussion and Application of High-Precision Flexible Circuit Board Defect Detection Technology | Anna Liu, Shenzhen Prevision Techonlogy Limited |
10:45-11:05 | Research progress in optical inspection technology for integrated circuits | Shuchun Huo, Vise Professor, The Institute of Microelectronics of the Chinese Academy of Sciences |
11:05-11:25 | Research and application of innovative method of wafer appearance 3D measurement based on AI | Nick Ou, Product Director, Wuhan jingce Elecronic Group Co.,LTD |
11:25-11:45 | Current status and new principle of patterned wafer defect detection | Jinlong Zhu, Professor, Huazhong University of Science and Technology |
11:45-12:05 | Optical Inspection Technologies for Wafers and Integrated Circuits | Zhouling Wu, Chief Scientist, ZC Optoelectronic Technologies, Ltd |
12:05-12:25 | Semiconductor 3D metrologies | Jinbo Jiang, Deputy Director, Hong Kong Applied Science and Technology Research Institute |
Professor, Dean, Xi’an Jiaotong University
Shenzhen Prevision Techonlogy Limited
Professor, The Institute of Microelectronics of the Chinese Academy of Sciences
Professor, Huazhong University of Science and Technology
Chief Scientist, ZC Optoelectronic Technologies, Ltd
Deputy Director, Hong Kong Applied Science and Technology Research Institute