` China international Optoelectronic Exposition Conference (CIOEC)

Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum

Date:TBD
Venue:TBD

Organizer

The International Optoelectronic Expo (CIOE)

National Optoelectronics Innovation Center

Photonics Society of Chinese-Americans (PSC)

The Optical Society of America (OSA)

In the 5G Internet, cloud computing, big data and other new high-bandwidth services and applications continue to promote the carrier telecommunications market, network service traffic and data center optical interconnection network evolution and upgrading of the use of optoelectronic chip rate requirements, design processes, packaging forms, performance technology requirements upgrade. Optical chips carry an important role in key business scenarios, but the localization rate of China's core optical communication chips is still relatively low, at present, China's high-end laser chip technology and products still rely mainly on imports, high-speed rate of 25Gb / s and above optical communication chips localization rate of no more than 15%. In the face of foreign technology blockade, the domestic optical chip local market how to respond? How to effectively overcome the optical chip integration technology, wafer manufacturing and chip testing and packaging technology, the upstream and downstream industry chain of optical chips still need to face the optical chip industry together and discuss together. Therefore, CIOE will invite the upstream and downstream companies and experts in the optical chip industry to participate in the "Optical Chip Design, Manufacturing and Packaging Technology Forum" for in-depth communication and discussion.

Directions: Local market development of domestic optoelectronic chips; integrated optoelectronic chip design process and EDA tools; optoelectronic chip manufacturing process, optoelectronic chip integrated packaging technology; optoelectronic chip functional testing, optoelectronic chip processing technology; silicon-based material-based optoelectronic chip integration technology

中国国际光电高峰论坛(CIOEC)

Agenda

光电子芯片设计及制造、封装技术论坛

*请左右滑动查看完整会议一览表

Times Topics Speakers & Companies
HOST: Zhiping Zhou, Professor of Peking University
10:00-10:05 Opening Host: Zhiping Zhou, Professor of Peking University
10:05-10:30 White Paper on Next-Generation 5G Optical Modules Bingbing Wu, Senior Engineer of IMT-2020(5G) Promotion Group 5G Transport Working Group
10:30-10:50 Commercialization of PAM4 53G/106G High Speed VCSEL Jiaxing Wang, R&D VP of Berxel Photonics Co.,Ltd
10:50-11:10 Silicon Photonics Technologie widely used in telecommunications and data centers Dong Pan, CEO of SiFotonics Technologies Co.,Ltd
11:10-11:30 The Application of Blade Sawing Machine in the Field of Optoelectronics Hualiang Wang, Project Director of Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd
11:30-11:55 Market Predictions for Silicon Photonics and Co-Packaged Optics Tom William, Senior Analyst of LightCounting
11:55-13:30 Lunch
HOST: Zhiping Zhou, Professor of Peking University
13:30-13:35 Opening Host: Zhiping Zhou, Professor of Peking University
13:35-14:00 Discussion on the optical module industry chain of telecom network sharing data center Ph.D Shikui Shen, Expert of China Unicom
14:00-14:20 Discussion on photonics chip assembly technology, equipment and development trends LIMIN ZHOU, General Manager of MRSI Automation(Shenzhen)Co.,Ltd
14:20-14:45 Silicon Based Optoelectronics: the key enabling technology for miniaturizing information systems Zhiping Zhou, Professor of Peking University
14:45-15:05 A provider for VCSEL chip custom processing service Dr. Yu Xiang, VP of VCSEL R&D, Toptrans (Suzhou) Co.,Ltd
15:05-15:25 External Light Source Technology and Application Pims Nie, Deputy Director of AOI
15:25-15:45 Introduction of High Power DFB Lasers for CPO and Silicon Photonics Platforms Dr. Andy Piper, Senior VP of Global Business Development of DenseLight Semiconductors Pte Ltd
15:45-16:05 RF test instrument application in optoelectronic component testing Guoying Fu, Application Manager of Rohde & Schwarz (China)Technology Co.,Ltd

Agenda

Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum
Times Topics Invited guests
HOST: Zhiping Zhou, Professor of Peking University
10:00-10:05 Opening Host: Zhiping Zhou, Professor of Peking University
10:05-10:30 White Paper on Next-Generation 5G Optical Modules Bingbing Wu, Senior Engineer of IMT-2020(5G) Promotion Group 5G Transport Working Group
10:30-10:50 Commercialization of PAM4 53G/106G High Speed VCSEL Jiaxing Wang, R&D VP of Berxel Photonics Co.,Ltd
10:50-11:10 Silicon Photonics Technologie widely used in telecommunications and data centers Dong Pan, CEO of SiFotonics Technologies Co.,Ltd
11:10-11:30 The Application of Blade Sawing Machine in the Field of Optoelectronics Hualiang Wang, Project Director of Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd
11:30-11:55 Market Predictions for Silicon Photonics and Co-Packaged Optics Tom William, Senior Analyst of LightCounting
11:55-13:30 Lunch
HOST: Zhiping Zhou, Professor of Peking University
13:30-13:35 Opening Host: Zhiping Zhou, Professor of Peking University
13:35-14:00 Discussion on the optical module industry chain of telecom network sharing data center Ph.D Shikui Shen, Expert of China Unicom
14:00-14:20 Discussion on photonics chip assembly technology, equipment and development trends LIMIN ZHOU, General Manager of MRSI Automation(Shenzhen)Co.,Ltd
14:20-14:45 Silicon Based Optoelectronics: the key enabling technology for miniaturizing information systems Zhiping Zhou, Professor of Peking University
14:45-15:05 A provider for VCSEL chip custom processing service Dr. Yu Xiang, VP of VCSEL R&D, Toptrans (Suzhou) Co.,Ltd
15:05-15:25 External Light Source Technology and Application Pims Nie, Deputy Director of AOI
15:25-15:45 Introduction of High Power DFB Lasers for CPO and Silicon Photonics Platforms Dr. Andy Piper, Senior VP of Global Business Development of DenseLight Semiconductors Pte Ltd
15:45-16:05 RF test instrument application in optoelectronic component testing Guoying Fu, Application Manager of Rohde & Schwarz (China)Technology Co.,Ltd

Guest Introduction

*In no particular order

Other Conference

2021 Other Conference

Sponsor

宁波环球广电
希烽光电
博升光电
实光半导体
长瑞光电
迈锐斯
大族半导体
罗德与施瓦茨
国家信息光电子创新中心

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