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Optoelectronic Integration and Chips（Finished）
Time：September 4-6, 2019
Site：Shenzhen Convention & Exhibition Center
Language：
Co-organized by OEIC and CIOE, will focus on optoelectronic devices, silicon integrated optoelectronic technology and optoelectronic integration of new products, new processes, new progress, show China's new achievements in the core chip technology field to promote the rapid development of China's core optical communication technology

Conference agenda

Optoelectronic Integration and Chips（Finished）
TimeSpeech titleIntended Guests
08:50-09:20RegistrationSpeakers and Attendees Check-in
09:20-09:25Opening PresentationZhou Zhiping,“Changjiang” Professor at Peking University; The funding Editor-in-Chief of Photonics Research; Fellow of OSA, SPIE, and IET.
09:25-09:50Keynote Report: Silicon Photonics. Beyond the tipping pointEric Mounier , Fellow Analyst, Photonics, Sensing and Displays Division, Yole Développement
09:50-10:15Industry Report: Microcomb based on integrated microresonatorsZhang Wenfu Deputy director, Doctor of Xi'an Institute of Optics and Precision Mechanics,Chinese Academy of Sciences
10:15-10:40Industry Report: 7nm Coherent DSP: Enabler for New Network Architectures and MarketsSr. Director, Product Line Marketing, Inphi Corporation
10:40-11:05Industry Report： Optoelectronic Components for Next Generation DatacenterJason Lee Product Marketing Manager, FOPD, Broadcom Ltd.
11:05-11:30Industry Report :Photonic-electronic heterogeneous processor for AI computingBai Bing CEO of Photoncounts Technology Co.Ltd, Doctor of optical wave technology institute, Beijing jiaotong university
11:30-11:55Industry Report : The key challenge of Optical Transmission Core Device Development for 5G Base StationLiu Wen Director of Key Laboratory of Optoelectronic Science and Technology, School of Physical Sciences, University of Science and Technology of China, Cheung Kong Scholar Chair Professor.

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