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Optoelectronic Chip Integration Technology and Application Forum (Finished)
Time：Sept 16, PM, 2021
Site：6B, 2nd Floor, Hall 6, Shenzhen World Exhibition and Convention Center
Language：
Co hosting
China Internatonal Optoelectronic Exposition
Photonics Society of Chinese-Americans (PSC)
The Optical Society (OSA)
With the advancing of China’s new infrastructure strategy, 100G+400G has become the mainstream demand of IDC market. The explosive demand for optical module in telecom and datacom market inevitably arrive for increasing 5G base station and transmission speed. . Although China’s module packaging technology is going to spreadhead, the chips and integration technology are still in the bottleneck. Facing foreign technical blockade, CIOEC will invite domestic and foreign well-known device enterprises and scientific research experts to participate in the " Optoelectronic Chip Integration Technology and Application Forum " to discuss the key technology of optical chip, optoelectronic devices, optical module integration and application technology.
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Conference agenda

Optoelectronic Chip Integration Technology and Application Forum (Finished)
TimeTopicsSpeakers
Host: Zhiping Zhou, Professor of Peking University，OSA，SPIE，IET Fellow
13:35-14:00Development trend and standardization progress of optoelectronic chips and components integration technologyBinbin Wu, Senior Engineer at the Institute of Technology and Standards of China Academy of Information and Communications Technology(CAICT)
14:00-14:20Best balance cross performance and system cost – next generation high-speed optical module control platform discussionMorton Zhao, GM, China Technology Groups of Analog Devices Inc.
14:20-14:40Silicon Photonics Technology New ApplicationDong Pan, CEO of SiFotonics Technologies
14:40-15:00Silicon Photonics Integrated Optical Engines – DPhi Packaging Hybrid Integration ProcessComing Chen, COO of DenseLight Semiconductors
15:00-15:15Teabreak
15:15-15:40Standardization and Application of tunable laser techniquePh.D Shikui Shen, Project Manager of China Unicom
15:40-16:00Photonics-SOI solutions for datacenter transceivers and the cloud infrastructureWenhong Chen, China Sales Director of Soitec
16:00-16:20Realization & Application of on-chip integrated OAM technologyJiajun Zheng, CTO of Hengxin Semitech Co., Ltd.
16:20-16:40Silicon photonics technology for Co-packaged opticsJunbo Feng,Director of silicon photonics center, Chongqing United Microelectronics Center

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Optoelectronic Chip Integration Technology and Application Forum
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