` China international Optoelectronic Exposition Conference (CIOEC)

EPIC TechWatch

Date:10:00 – 12:00 17 September, 2021
Venue:Conference Room, Hall 4, Shenzhen World Exhibition & Convention Center

Organizer

EPIC

China International Optoelectronic Exposition (CIOE)

EPIC (European Photonics Industry Consortium), the largest photonics industry association in the world, in cooperation with CIOE 2021 – the 23rd China International Optoelectronic Exposition, introduces innovative technology companies for collaboration and partnership in China. We invite you to learn about the leading edge European photonics technologies at the EPIC TechWatch on 17 September from 10:00 – 12:00 in the conference room, Hall 4, Shenzhen World Exhibition & Convention Center. Presentations will be held in Chinese. Presentations are focused on electro-optics, optical communication, and photonics technologies.

中国国际光电高峰论坛(CIOEC)

Agenda

欧洲光电产业协会技术展望大会

*请左右滑动查看完整会议一览表

Times Topics Speakers & Companies
10:00 – 10:03 Welcome by the moderator Robert Wu, Sales Representative, PHIX Photonics Assembly
10:03 – 10:05 Pre-recorded welcoming Carlos Lee, Director General, EPIC – European Photonics Industry Consortium
10:05 – 10:15 Welcoming address Jackson J. Rothe, Founder, Managing Director, SINOLUMINA
10:15 - 10:30 New Products for Hyperscale Customers Tom William, Senior Analyst, LightCounting Market Research
10:30 – 10: 45 The WDM Component Characterisation Challenge Peter Chan, Vice President of APAC Business Development, Santec
10:45 – 11:00 AuSn Thin Film Technology and AuSn Pre-deposited Substrates for Optoelectronics Allen Liu, Product Line Manager Diode Laser BU, Focuslight Technologies
11:00 – 11:15 3D Maskless lithography by two-photon polymerization for optical packaging  Peter Han, Sales Engineer, Nanoscribe
11:15 – 11:30 Lithography and Etching based Micro Optic Cynthia Zhao, Business Development Director, Axetris
11:30 – 11:45 Challenge on fiber interconnect for CPO John Lu, Product Manager, Senko Advanced Components
11:45 – 12:00 (Hybrid) PIC packaging and the volume scale up Robert Wu, Sales Representative, PHIX Photonics Assembly
12:00 Closing address Robert Wu, Sales Representative, PHIX Photonics Assembly

Agenda

EPIC TechWatch
Times Topics Invited guests
10:00 – 10:03 Welcome by the moderator Robert Wu, Sales Representative, PHIX Photonics Assembly
10:03 – 10:05 Pre-recorded welcoming Carlos Lee, Director General, EPIC – European Photonics Industry Consortium
10:05 – 10:15 Welcoming address Jackson J. Rothe, Founder, Managing Director, SINOLUMINA
10:15 - 10:30 New Products for Hyperscale Customers Tom William, Senior Analyst, LightCounting Market Research
10:30 – 10: 45 The WDM Component Characterisation Challenge Peter Chan, Vice President of APAC Business Development, Santec
10:45 – 11:00 AuSn Thin Film Technology and AuSn Pre-deposited Substrates for Optoelectronics Allen Liu, Product Line Manager Diode Laser BU, Focuslight Technologies
11:00 – 11:15 3D Maskless lithography by two-photon polymerization for optical packaging  Peter Han, Sales Engineer, Nanoscribe
11:15 – 11:30 Lithography and Etching based Micro Optic Cynthia Zhao, Business Development Director, Axetris
11:30 – 11:45 Challenge on fiber interconnect for CPO John Lu, Product Manager, Senko Advanced Components
11:45 – 12:00 (Hybrid) PIC packaging and the volume scale up Robert Wu, Sales Representative, PHIX Photonics Assembly
12:00 Closing address Robert Wu, Sales Representative, PHIX Photonics Assembly

Official Wechat