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EPIC
China International Optoelectronic Exposition (CIOE)
EPIC (European Photonics Industry Consortium), the largest photonics industry association in the world, in cooperation with CIOE 2021 – the 23rd China International Optoelectronic Exposition, introduces innovative technology companies for collaboration and partnership in China. We invite you to learn about the leading edge European photonics technologies at the EPIC TechWatch on 17 September from 10:00 – 12:00 in the conference room, Hall 4, Shenzhen World Exhibition & Convention Center. Presentations will be held in Chinese. Presentations are focused on electro-optics, optical communication, and photonics technologies.
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| Times | Topics | Speakers & Companies |
|---|---|---|
| 10:00 – 10:03 | Welcome by the moderator | Robert Wu, Sales Representative, PHIX Photonics Assembly |
| 10:03 – 10:05 | Pre-recorded welcoming | Carlos Lee, Director General, EPIC – European Photonics Industry Consortium |
| 10:05 – 10:15 | Welcoming address | Jackson J. Rothe, Founder, Managing Director, SINOLUMINA |
| 10:15 - 10:30 | New Products for Hyperscale Customers | Tom William, Senior Analyst, LightCounting Market Research |
| 10:30 – 10: 45 | The WDM Component Characterisation Challenge | Peter Chan, Vice President of APAC Business Development, Santec |
| 10:45 – 11:00 | AuSn Thin Film Technology and AuSn Pre-deposited Substrates for Optoelectronics | Allen Liu, Product Line Manager Diode Laser BU, Focuslight Technologies |
| 11:00 – 11:15 | 3D Maskless lithography by two-photon polymerization for optical packaging | Peter Han, Sales Engineer, Nanoscribe |
| 11:15 – 11:30 | Lithography and Etching based Micro Optic | Cynthia Zhao, Business Development Director, Axetris |
| 11:30 – 11:45 | Challenge on fiber interconnect for CPO | John Lu, Product Manager, Senko Advanced Components |
| 11:45 – 12:00 | (Hybrid) PIC packaging and the volume scale up | Robert Wu, Sales Representative, PHIX Photonics Assembly |
| 12:00 | Closing address | Robert Wu, Sales Representative, PHIX Photonics Assembly |
| Times | Topics | Invited guests |
|---|---|---|
| 10:00 – 10:03 | Welcome by the moderator | Robert Wu, Sales Representative, PHIX Photonics Assembly |
| 10:03 – 10:05 | Pre-recorded welcoming | Carlos Lee, Director General, EPIC – European Photonics Industry Consortium |
| 10:05 – 10:15 | Welcoming address | Jackson J. Rothe, Founder, Managing Director, SINOLUMINA |
| 10:15 - 10:30 | New Products for Hyperscale Customers | Tom William, Senior Analyst, LightCounting Market Research |
| 10:30 – 10: 45 | The WDM Component Characterisation Challenge | Peter Chan, Vice President of APAC Business Development, Santec |
| 10:45 – 11:00 | AuSn Thin Film Technology and AuSn Pre-deposited Substrates for Optoelectronics | Allen Liu, Product Line Manager Diode Laser BU, Focuslight Technologies |
| 11:00 – 11:15 | 3D Maskless lithography by two-photon polymerization for optical packaging | Peter Han, Sales Engineer, Nanoscribe |
| 11:15 – 11:30 | Lithography and Etching based Micro Optic | Cynthia Zhao, Business Development Director, Axetris |
| 11:30 – 11:45 | Challenge on fiber interconnect for CPO | John Lu, Product Manager, Senko Advanced Components |
| 11:45 – 12:00 | (Hybrid) PIC packaging and the volume scale up | Robert Wu, Sales Representative, PHIX Photonics Assembly |
| 12:00 | Closing address | Robert Wu, Sales Representative, PHIX Photonics Assembly |
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