Time | Topics | Speakers |
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10:00 – 10:03 | Welcome by the moderator | Robert Wu, Sales Representative, PHIX Photonics Assembly |
10:03 – 10:05 | Pre-recorded welcoming | Carlos Lee, Director General, EPIC – European Photonics Industry Consortium |
10:05 – 10:15 | Welcoming address | Jackson J. Rothe, Founder, Managing Director, SINOLUMINA |
10:15 - 10:30 | New Products for Hyperscale Customers | Tom William, Senior Analyst, LightCounting Market Research |
10:30 – 10: 45 | The WDM Component Characterisation Challenge | Peter Chan, Vice President of APAC Business Development, Santec |
10:45 – 11:00 | AuSn Thin Film Technology and AuSn Pre-deposited Substrates for Optoelectronics | Allen Liu, Product Line Manager Diode Laser BU, Focuslight Technologies |
11:00 – 11:15 | 3D Maskless lithography by two-photon polymerization for optical packaging | Peter Han, Sales Engineer, Nanoscribe |
11:15 – 11:30 | Lithography and Etching based Micro Optic | Cynthia Zhao, Business Development Director, Axetris |
11:30 – 11:45 | Challenge on fiber interconnect for CPO | John Lu, Product Manager, Senko Advanced Components |
11:45 – 12:00 | (Hybrid) PIC packaging and the volume scale up | Robert Wu, Sales Representative, PHIX Photonics Assembly |
12:00 | Closing address | Robert Wu, Sales Representative, PHIX Photonics Assembly |