With the continuous promotion of 5G Internet, cloud computing, big data and other new high-bandwidth services and applications, the network service traffic in the telecom market and the evolution and upgrading of optical interconnect networks in data centers require upgrading of optical electronic chip rate, design technology, packaging form, and performance technology. At present, China's core optical communication chip localization rate is still relatively low. As for how to effectively overcome the optical chip integration technology, wafer manufacturing, and chip testing and packaging technology of the optical chip upstream and downstream industry, it needs optical chip players to discuss together.