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0to CIOE 2023 Opening Booth Application |
Organizer
China Internatonal Optoelectronic Exposition
Photonics Society of Chinese-Americans (PSC)
The Optical Society (OSA)
With the advancing of China’s new infrastructure strategy, 100G+400G has become the mainstream demand of IDC market. The explosive demand for optical module in telecom and datacom market inevitably arrive for increasing 5G base station and transmission speed. . Although China’s module packaging technology is going to spreadhead, the chips and integration technology are still in the bottleneck. Facing foreign technical blockade, CIOEC will invite domestic and foreign well-known device enterprises and scientific research experts to participate in the " Optoelectronic Chip Integration Technology and Application Forum " to discuss the key technology of optical chip, optoelectronic devices, optical module integration and application technology.
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Times | Topics | Speakers & Companies |
---|---|---|
Host: Zhiping Zhou, Professor of Peking University,OSA,SPIE,IET Fellow | ||
13:35-14:00 | Development trend and standardization progress of optoelectronic chips and components integration technology | Binbin Wu, Senior Engineer at the Institute of Technology and Standards of China Academy of Information and Communications Technology(CAICT) |
14:00-14:20 | Best balance cross performance and system cost – next generation high-speed optical module control platform discussion | Morton Zhao, GM, China Technology Groups of Analog Devices Inc. |
14:20-14:40 | Silicon Photonics Technology New Application | Dong Pan, CEO of SiFotonics Technologies |
14:40-15:00 | Silicon Photonics Integrated Optical Engines – DPhi Packaging Hybrid Integration Process | Coming Chen, COO of DenseLight Semiconductors |
15:00-15:15 | Teabreak | |
15:15-15:40 | Standardization and Application of tunable laser technique | Ph.D Shikui Shen, Project Manager of China Unicom |
15:40-16:00 | Photonics-SOI solutions for datacenter transceivers and the cloud infrastructure | Wenhong Chen, China Sales Director of Soitec |
16:00-16:20 | Realization & Application of on-chip integrated OAM technology | Jiajun Zheng, CTO of Hengxin Semitech Co., Ltd. |
16:20-16:40 | Silicon photonics technology for Co-packaged optics | Junbo Feng,Director of silicon photonics center, Chongqing United Microelectronics Center |
Times | Topics | Invited guests |
---|---|---|
Host: Zhiping Zhou, Professor of Peking University,OSA,SPIE,IET Fellow | ||
13:35-14:00 | Development trend and standardization progress of optoelectronic chips and components integration technology | Binbin Wu, Senior Engineer at the Institute of Technology and Standards of China Academy of Information and Communications Technology(CAICT) |
14:00-14:20 | Best balance cross performance and system cost – next generation high-speed optical module control platform discussion | Morton Zhao, GM, China Technology Groups of Analog Devices Inc. |
14:20-14:40 | Silicon Photonics Technology New Application | Dong Pan, CEO of SiFotonics Technologies |
14:40-15:00 | Silicon Photonics Integrated Optical Engines – DPhi Packaging Hybrid Integration Process | Coming Chen, COO of DenseLight Semiconductors |
15:00-15:15 | Teabreak | |
15:15-15:40 | Standardization and Application of tunable laser technique | Ph.D Shikui Shen, Project Manager of China Unicom |
15:40-16:00 | Photonics-SOI solutions for datacenter transceivers and the cloud infrastructure | Wenhong Chen, China Sales Director of Soitec |
16:00-16:20 | Realization & Application of on-chip integrated OAM technology | Jiajun Zheng, CTO of Hengxin Semitech Co., Ltd. |
16:20-16:40 | Silicon photonics technology for Co-packaged optics | Junbo Feng,Director of silicon photonics center, Chongqing United Microelectronics Center |
Optoelectronic Chip Integration Technology and Application Forum
Standard Price¥800/Early Bird¥600 (Early Bird Rate before July 31st, 2021)
Get more 4 Forums for 2021 Information Communication Industry:
Standard Price¥1800/Early Bird¥1600 (Early Bird Rate before July 31st, 2021)
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