` China international Optoelectronic Exposition Conference (CIOEC)

Optoelectronic Chip Integration Technology and Application Forum

Date:Sept 16, PM, 2021
Venue:6B, 2nd Floor, Hall 6, Shenzhen World Exhibition and Convention Center

Organizer

China Internatonal Optoelectronic Exposition

Photonics Society of Chinese-Americans (PSC)

The Optical Society (OSA)

With the advancing of China’s new infrastructure strategy, 100G+400G has become the mainstream demand of IDC market. The explosive demand for optical module in telecom and datacom market inevitably arrive for increasing 5G base station and transmission speed. . Although China’s module packaging technology is going to spreadhead, the chips and integration technology are still in the bottleneck. Facing foreign technical blockade, CIOEC will invite domestic and foreign well-known device enterprises and scientific research experts to participate in the " Optoelectronic Chip Integration Technology and Application Forum " to discuss the key technology of optical chip, optoelectronic devices, optical module integration and application technology.

中国国际光电高峰论坛(CIOEC)

Agenda

光电子芯片集成技术与应用论坛

*请左右滑动查看完整会议一览表

Times Topics Speakers & Companies
Host: Zhiping Zhou, Professor of Peking University,OSA,SPIE,IET Fellow
13:35-14:00 Development trend and standardization progress of optoelectronic chips and components integration technology Binbin Wu, Senior Engineer at the Institute of Technology and Standards of China Academy of Information and Communications Technology(CAICT)
14:00-14:20 Best balance cross performance and system cost – next generation high-speed optical module control platform discussion Morton Zhao, GM, China Technology Groups of Analog Devices Inc.
14:20-14:40 Silicon Photonics Technology New Application Dong Pan, CEO of SiFotonics Technologies
14:40-15:00 Silicon Photonics Integrated Optical Engines – DPhi Packaging Hybrid Integration Process Coming Chen, COO of DenseLight Semiconductors
15:00-15:15 Teabreak
15:15-15:40 Standardization and Application of tunable laser technique Ph.D Shikui Shen, Project Manager of China Unicom
15:40-16:00 Photonics-SOI solutions for datacenter transceivers and the cloud infrastructure Wenhong Chen, China Sales Director of Soitec
16:00-16:20 Realization & Application of on-chip integrated OAM technology Jiajun Zheng, CTO of Hengxin Semitech Co., Ltd.
16:20-16:40 Silicon photonics technology for Co-packaged optics Junbo Feng,Director of silicon photonics center, Chongqing United Microelectronics Center

Agenda

Optoelectronic Chip Integration Technology and Application Forum
Times Topics Invited guests
Host: Zhiping Zhou, Professor of Peking University,OSA,SPIE,IET Fellow
13:35-14:00 Development trend and standardization progress of optoelectronic chips and components integration technology Binbin Wu, Senior Engineer at the Institute of Technology and Standards of China Academy of Information and Communications Technology(CAICT)
14:00-14:20 Best balance cross performance and system cost – next generation high-speed optical module control platform discussion Morton Zhao, GM, China Technology Groups of Analog Devices Inc.
14:20-14:40 Silicon Photonics Technology New Application Dong Pan, CEO of SiFotonics Technologies
14:40-15:00 Silicon Photonics Integrated Optical Engines – DPhi Packaging Hybrid Integration Process Coming Chen, COO of DenseLight Semiconductors
15:00-15:15 Teabreak
15:15-15:40 Standardization and Application of tunable laser technique Ph.D Shikui Shen, Project Manager of China Unicom
15:40-16:00 Photonics-SOI solutions for datacenter transceivers and the cloud infrastructure Wenhong Chen, China Sales Director of Soitec
16:00-16:20 Realization & Application of on-chip integrated OAM technology Jiajun Zheng, CTO of Hengxin Semitech Co., Ltd.
16:20-16:40 Silicon photonics technology for Co-packaged optics Junbo Feng,Director of silicon photonics center, Chongqing United Microelectronics Center

Guest Introduction

*In no particular order

Registration

Optoelectronic Chip Integration Technology and Application Forum

Standard Price¥800/Early Bird¥600 (Early Bird Rate before July 31st, 2021)

Get more 4 Forums for 2021 Information Communication Industry:

Standard Price¥1800/Early Bird¥1600 (Early Bird Rate before July 31st, 2021)

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Pls send email to contact us

Ms. Rose Yang

Email: rose.yang@cioe.cn

Tel: 86-0755-88242572

Other Conference

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Sponsor

江苏亨通光电股份有限公司/HENGTONG GROUP
亚德诺半导体技术(上海)有限公司/ Analog Devices Inc.
希烽光电科技(南京)有限公司/SiFotonics Technologies
实光半导体公司/Denselight Semiconductor Pte Ltd (Singapore)
联合微电子中心有限责任公司/ United Microelectronics Center (CUMEC)
Soitec

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