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Semiconductor Laser Technology Innovation and Application Forum (Finished)
Time:Sep 6, PM
Site:2C, 2nd Floor, Hall 2
The International Optoelectronic Expo (CIOE)
South China Normal University
Shenzhen UBM Herong Exhibition Co., Ltd
Semiconductor bears the responsibility of protecting the strategic security of domestic industry, and the trend of "domestic substitution" of supply chain localization is inevitable. With the accelerated deployment of "new infrastructure", it will promote the third-generation semiconductor industry represented by silicon carbide to enter the development dividend period, and further achieve all-round penetration in new infrastructure fields such as 5G infrastructure, UHV, intercity high-speed rail and intercity rail transit, smart grid, big data center and industrial Internet. In the context of the rise of the manufacturing industry in China's optical processing era, the development of the domestic semiconductor industry is unstoppable, and the proportion of wafer production capacity in the world continues to grow. The overall demand for semiconductors determines the simultaneous expansion of the scale of semiconductor materials and the industry processing market. The laser processing technology with the advantages of fine processing and ultrafast processing is gradually replacing the traditional processing methods of chips. In the era of the chip outbreak, what further needs do high-quality product quality have for processing technology? What are the highlights of the application development of laser technology?
The "Semiconductor laser Technology Innovation and Application Forum" will invite experts in the laser field, well-known enterprises in the industry and senior executives of application enterprises to participate in the discussion.

Conference agenda

Semiconductor Laser Technology Innovation and Application Forum (Finished)
Host: Qingmao Zhang, School of Information Optoelectronics Science and Technology, South China Normal University, Professor
14:05-14:25Laser Industry in PRC: the Present and the ChallengeQingmao Zhang, School of Information Optoelectronics Science and Technology, South China Normal University, Professor
14:25-14:45Laser Micro Machining of Brittle MaterialsShibin Jiang,Hangzhou Yinhu Laser Technology Co,Ltd.Chairman
14:45-15:05TRUMPF laser innovation promote the upgrading of semiconductor manufacturing Ray Zhang, TRUMPF (China) Co, Ltd.Industry & product management Team Leader
15:05-15:25The latest progress and future development layout of laser chipsRichard Liao, Suzhou Everbright Photonics Co., Ltd.Co-founder Deputy General Manager
15:25-15:45Development and application prospect of domestic rare earth doped fiber for laser diode pumpingWei Sun, Jiangsu Alpha Optic-Electric Technology Co,Ltd.Senior Engineer
15:45-16:05Narrow linewidth semiconductor lasers and their applicationsChao Chen,Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences.Associate Professor
16:05-16:25The development trend of laser precision machining and digital laser beam shappingMing Lu,Shenzhen Tede Laser Technology Co,Ltd.Vice President
16:25-16:45Global Semiconductor Industry Trend OverviewEllike Chen,Sigamintell Consulting Co,Ltd.Vice President and Chief Analyst

Guest Introduction

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