Laser technology, characterized by its high precision, non-contact operation, and high efficiency, is profoundly enabling the upgrade of the semiconductor industry chain across various fields, including integrated circuits, display panels, photovoltaics, and semiconductor lighting.

In chip manufacturing, extreme ultraviolet (EUV) lithography is breaking through the sub-7nm process bottleneck, supporting the development of advanced 5G and AI chips. For display technology, excimer laser annealing (ELA) facilitates the preparation of low-temperature polysilicon films for OLED panels, thereby improving resolution. Additionally, ultrafast lasers (femtosecond/picosecond) are applied to Mini/Micro LEDchip dicing, boosting production yields to as high as 99.9%.

Furthermore, other laser applications are critical for quality and cost-efficiency. Laser-induced breakdown spectroscopy (LIBS) enables online wafer defect detection, fiber laser welding ensures the reliability of IGBT module packaging, and laser lift-off technology for silicon carbide substrates is helping to reduce costs and increase the efficiency of third-generation semiconductors.

The "Laser Technology Empowering Pan-Semiconductor Industry Manufacturing Forum" aims to bring together experts, scholars, enterprise representatives, and industry leaders from the fields of laser technology and the pan-semiconductor industry. The forum will focus on fostering collaborative innovation in manufacturing, advancing technological research, and building a robust ecosystem for the entire industrial chain.