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Laser Technology Enabling Mini/MicroLED Display Manufacturing Forum (Finished)
Time:2024-09-11
Venue:2A, 2nd Floor, Hall 2
Language:CN


Organizer

China International Optoelectronic Expo (CIOE)  

LED technology is moving in the direction of high-definition. With the continuous update and iteration of products in the fields of TV, wearable devices, smart phones, tablets, automotive electronics, etc., the market has higher requirements for screen size and equipment accuracy, especially the launch of full-screen mobile phones and large-size TVS, the proportion of demand for large screens continues to rise, and Mini/Micro LED has become the mainstream trend. In the process of manufacturing panels, because the Mini LED chip size is between 50-200 microns, and the Micro LED chip size is below 50 microns, a large number of chips need to be transplanted to the drive panel on a large scale through laser transfer technology to form a high-density array, and the chip is prone to adverse results in the process. The laser repair equipment can screen and repair the defective chips in the process to improve the product yield. In addition, in order to ensure the quality of the final product, the Mini LED after backcuring needs to be repaired to remove and replace poorly welded or chip components. However, due to the small chip of Mini LED, manual repair has high cost, low efficiency, poor repair quality and other problems, the use of laser repair technology can effectively improve the efficiency and quality of the repair, providing an effective guarantee for the mass production of Mini LED. At present, the laser has become one of the key equipment required in the manufacturing process of Mini/Micro LED.

The "Laser Technology Enabling Mini/Micro LED Display Device Manufacturing Forum" will invite experts in the laser field, well-known enterprises in the industry and new display application enterprises to jointly discuss the application and technological innovation of laser in display equipment manufacturing.

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Conference agenda

Laser Technology Enabling Mini/MicroLED Display Manufacturing Forum (Finished)
TimeTopicsSpeakers
Host: Baoping Zhang, Xiamen University, Professor
14:00-14:05Opening
14:05-14:25Laser Liftoff for High-Quality GaN Microcavity and Optoelectronic DevicesBaoping Zhang, Xiamen University, Professor
14:25-14:45MicroLED Display R&D Progress and Laser Mass Transfer Technology SharingChanghui Zhuang, Guangdong Han's Semiconductor Equipment Co., Ltd., R&D Director
14:45-15:05Analysis of the Application of Advanced Laser Technology to Micro LED IndustrializationChun-Lung Hsiao, Chongqing Konka Optoelectronics Technology Co., Ltd., Vice General Manager
15.05-15:25Laser Solutions for Mass Bonding and Repair of Micro LEDEthan Wang, Hymson Laser Technology Group Co.,Ltd., Technical Director
15:25-15:45Advanced Laser Technology Promotes The Green and Intelligent Manufacturing of Hard and Brittle Materials IndustryQingfeng Yuan, Wuhan HGLaser Engineering Co., Ltd, Semiconductor Panel Division Chief Inspector
15:45-16:05Application of Laser Technology in MLED RepairDr. Quan Tang, Project Manager, Anhui Boyi Laser Technology Co., Ltd
16:05-16:25Mini LED/Micro LED Industry Trend Development OutlookXuecheng Chen, Senior Analyste, Sigamintell

Guest Introduction

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