Organizer
China International Optoelectronic Expo (CIOE)
LED technology is moving in the direction of high-definition. With the continuous update and iteration of products in the fields of TV, wearable devices, smart phones, tablets, automotive electronics, etc., the market has higher requirements for screen size and equipment accuracy, especially the launch of full-screen mobile phones and large-size TVS, the proportion of demand for large screens continues to rise, and Mini/Micro LED has become the mainstream trend. In the process of manufacturing panels, because the Mini LED chip size is between 50-200 microns, and the Micro LED chip size is below 50 microns, a large number of chips need to be transplanted to the drive panel on a large scale through laser transfer technology to form a high-density array, and the chip is prone to adverse results in the process. The laser repair equipment can screen and repair the defective chips in the process to improve the product yield. In addition, in order to ensure the quality of the final product, the Mini LED after backcuring needs to be repaired to remove and replace poorly welded or chip components. However, due to the small chip of Mini LED, manual repair has high cost, low efficiency, poor repair quality and other problems, the use of laser repair technology can effectively improve the efficiency and quality of the repair, providing an effective guarantee for the mass production of Mini LED. At present, the laser has become one of the key equipment required in the manufacturing process of Mini/Micro LED.
The "Laser Technology Enabling Mini/Micro LED Display Device Manufacturing Forum" will invite experts in the laser field, well-known enterprises in the industry and new display application enterprises to jointly discuss the application and technological innovation of laser in display equipment manufacturing.
Time | Topics | Speakers |
---|---|---|
Host: Baoping Zhang, Xiamen University, Professor | ||
14:00-14:05 | Opening | |
14:05-14:25 | Laser Liftoff for High-Quality GaN Microcavity and Optoelectronic Devices | Baoping Zhang, Xiamen University, Professor |
14:25-14:45 | MicroLED Display R&D Progress and Laser Mass Transfer Technology Sharing | Changhui Zhuang, Guangdong Han's Semiconductor Equipment Co., Ltd., R&D Director |
14:45-15:05 | Analysis of the Application of Advanced Laser Technology to Micro LED Industrialization | Chun-Lung Hsiao, Chongqing Konka Optoelectronics Technology Co., Ltd., Vice General Manager |
15.05-15:25 | Laser Solutions for Mass Bonding and Repair of Micro LED | Ethan Wang, Hymson Laser Technology Group Co.,Ltd., Technical Director |
15:25-15:45 | Advanced Laser Technology Promotes The Green and Intelligent Manufacturing of Hard and Brittle Materials Industry | Qingfeng Yuan, Wuhan HGLaser Engineering Co., Ltd, Semiconductor Panel Division Chief Inspector |
15:45-16:05 | Application of Laser Technology in MLED Repair | Dr. Quan Tang, Project Manager, Anhui Boyi Laser Technology Co., Ltd |
16:05-16:25 | Mini LED/Micro LED Industry Trend Development Outlook | Xuecheng Chen, Senior Analyste, Sigamintell |
Xiamen University, Professor
Guangdong Han's Semiconductor Equipment Co., Ltd.
Chongqing Konka Optoelectronics Technology Co., Ltd., Vice General Manager
Hymson Laser Technology Group Co.,Ltd., Technical Director
Semiconductor Panel Division Chief Inspector, Wuhan HGLaser Engineering Co., Ltd
Project Manager, Anhui Boyi Laser Technology Co., Ltd
Senior Analyst, Sigamintell