Efficient and accurate laser processing equipment has deeply penetrated into all aspects of manufacturing and processing, and has become an important force to promote intelligent manufacturing in the new era while greatly improving production efficiency. Ultrafast lasers are widely used in applications such as cutting transparent and brittle materials, welding plastics, selective material removal, precision perforation, and surface structuring, meeting the process needs of fine manufacturing in the fields of consumer electronics and semiconductors, medical devices, glass and displays, and battery new energy. Especially in the context of today's global focus on carbon peak and carbon neutrality, the rise of the new energy industry has led to the rapid development of ultrafast laser technology. In addition, femtosecond laser processing is one of the most important precision machining means in the world today, and its unique processing method enables it to realize the processing and preparation of any three-dimensional structure, thus playing a vital role in the fields of integrated optics, quantum integrated chips and so on. The advantage of this technology is its ability to achieve fast writing without a mask in non-vacuum conditions, and to achieve machining accuracy beyond the optical diffraction limit. With the continuous progress of science and technology, the preparation of various nano-devices, optical quantum devices and photonic chips has put forward higher requirements for processing accuracy. In order to meet these needs, it is very important to study the laser limit machining accuracy and explore the new technology and mechanism of femtosecond laser near atomic scale manufacturing.

The "Ultrafast laser Micro-nano Processing and Manufacturing Forum" focused on the precise control process of laser for material processing, and how to improve the processing accuracy, and jointly explored the possibility of the next limit accuracy after the optical diffraction limit.