The increasing complexity of AI large models has led to a continuous increase in model parameters, putting forward new requirements for the global network infrastructure for high-speed data transmission. High-speed and large-bandwidth, deterministic low-latency, and connection reliability have become essential conditions. To meet these requirements, advanced all-optical transmission networks must be established between intelligent computing centers. High-speed optical communication technologies such as 400G/800G/1.6T, as the core technologies of intelligent computing clusters, are driving the continuous upgrading of data center interconnection solutions. At the same time, with the surging demand for AI computing power, the internal network of intelligent computing centers will develop towards higher speeds. The application of 800G/1.6T modules in intelligent computing clusters will become more and more widespread. The integration of emerging technologies such as the LPO scheme and liquid-cooling technology will further reduce the cost and power consumption of optical modules and meet the heat-dissipation requirements of high-density data centers. As the core device of optical communication technology, the continuous improvement of the performance and integration of optical chips, as well as the rapid development of advanced packaging technologies such as silicon photonics, CPO/NPO/LPO, provides new solutions for the integrated manufacturing of optical chips.

Despite the significant progress that optical communication technology has made, it still faces many challenges. For example, how to break through the inherent latency limit and the non-linear Shannon limit of existing single-mode fibers to achieve higher-speed and longer-distance data transmission is an urgent problem to be solved. At the same time, with the continuous increase in transmission distance, fiber loss will cause the signal strength to gradually decay, affecting the transmission quality. How to further reduce fiber loss and extend the transmission distance has become a subject that requires continuous in-depth research in the field of optical communication technology. The efficient integration of optical communication chips/devices is also the key to improving the overall performance of the system. However, the interfaces and standards among different manufacturers and devices are not yet unified, which greatly limits the interoperability of optical communication systems. Therefore, how to standardize and regulate optical communication systems and improve the interface compatibility among different manufacturers and devices is also an important direction that current optical communication technology needs to continuously explore and study.

In this context, CIOE is hosting the 2025 Information and Communication Industry Development Forum. The forum focuses on hot topics such as the key optical transmission technologies in the context of AI/ML, the diversified applications of 10G optical network scenarios, the new optical technologies for ultra-multi-card intelligent computing clusters, and the solutions for high-performance chip integrated manufacturing processes.

Organizer

China International Optoelectronic Exposition 

Optical Communication Committee of China Institute of Communications

Consulting Group of Transmission and Access Network of Telecommunication Science and Technology Committee of MIIT

Technology Standard Research Institute of China Academy of Information and Communications Technology

Cooperation

Photonics Society of Chinese Heritage (PSC)                   

Guidance

China Mobile                   China Telecom                   China Unicom

Media Partner

C114                   Optical Communication PRO