With the rapid development of the global semiconductor industry, optical semiconductor inspection technology, as the core link to ensure the yield and performance of chip manufacturing, is facing unprecedented opportunities and challenges. At present, the semiconductor manufacturing process has entered 5nm and below nodes, and the popularity of new technologies such as three-dimensional FinFET transistors and 3D NAND has made the microstructure more complex, placing higher requirements on the sensitivity, accuracy and efficiency of detection technology. With its advantages of non-contact, high precision and high speed, optical inspection technology has become an indispensable tool in the semiconductor manufacturing process, especially in the wafer defect detection, film thickness measurement, three-dimensional topography analysis and other fields.

In order to meet the development trend and requirements of detection and measurement technology to high speed, high sensitivity, high accuracy, high repeatability, and high cost performance, many technical improvements have been made in the industry. These improvements include enhancing the light intensity of the illumination, extending the spectral range to the DUV band, increasing the numerical aperture of the optical system, increasing the optical mode of illumination and acquisition, and expanding the application of optical algorithms and optical simulation in the field of inspection and measurement. The progress of these technologies provides support for the continuous improvement of integrated circuit manufacturing technology, and also indicates that the corresponding detection and measurement technology level will continue to improve.