Organizer
China International Optoelectronic Exposition
Photonics Society of Chinese Heritage (PSC)
Media Partner
C114、Optical Communication PRO
Against the backdrop of massive growth in computing infrastructure, the accelerated commercialization of AIGC, expansion of intelligent computing centers, and growth in the silicon photonic module market are boosting demand for optical chips. Silicon photonics, a key direction for chip development, is rapidly advancing. In February 2025, STMicroelectronics and AWS announced the upcoming mass production of the PIC100 chip, supporting 800G to 1.6T optical modules, showcasing silicon photonics potential. The PIC100 integrates discrete optoelectronic devices into a single chip, reducing power consumption by 30% with BiCMOS technology. This breakthrough is expected to address AI data interconnection bottlenecks.
However, optoelectronic chips face challenges, including multi-material integration, packaging technologies, and the need for sub-7nm processes. AI technology demands higher chip performance and energy efficiency, while optical networks require high-quality, high-capacity services. Optoelectronic chips need upgrades in reliability, stability, speed, design, packaging, and performance to meet transmission demands.
Against the aforementioned background, this conference will bring together experts and scholars from the field of optoelectronic chips, as well as representatives of upstream and downstream enterprises in the industry chain, to participate in the "High-Performance Optoelectronic Integrated Chips Technology Forum". The forum will delve into the latest technological advancements, application innovations, and future development directions of optoelectronic chips, promoting the sustainable growth of the optoelectronic chip industry.
Time | Topics | Speakers |
---|---|---|
10:00-10:05 | Welcome Speech | Host |
10:05-10:25 | Progress and Challenges of Integrated Optical Neural Networks | Hongwei Chen, Tenured Professor at the Department of Electronic Engineering, Tsinghua University |
10:25-10:45 | Technical Iterations of Highly Integrated Silicon Photonics Control IC | Murphy Mei, Director of Product Applications, Suzhou Legendsemi Technology Co., Ltd. |
10:45-11:05 | Keynote Speech | Lightwave Logic |
11:05-11:25 | Photonic Chips and Parallel Photonic Computing | Xie Peng, Professor, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences |
11:25-11:45 | CPO Manufacturing Solutions | Rudolf Kaiser, Technical Sales and CPO Business Development, ASMPT AMICRA GmbH |
11:45-12:05 | Technologies and Challenges of Optical Chips in the CPO Era | Johnny Wu, Vice General Manager, Suzhou Everbright Photonics Co., Ltd |
12:05-13:30 | Lunch | |
13:30-13:35 | Welcome Speech | Host |
13:35-13:55 | High-performance Silicon Photonic Devices and Chips | Daoxin Dai, Executive President of China Jiliang University, Qiushi Distinguished Professor/Dean of MOE's Joint lab of Photonics Technology at Zhejiang University |
13:55-14:15 | MKS Solutions for Silicon Photonics | Huaihai Pan, Senior Applications Engineer, MKS Newport |
14:15-14:35 | Scalable Sputtered Aluminum Nitride on Insulator for Integrated Photonics: Fabrication and Application Outlook | Thang Duy DAO, Staff Scientist, Silicon Austria Labs GmbH (SAL) |
14:35-14:55 | Discussion on Heterogeneous Integration of Silicon Photonics | Yu Zhu, Co-CTO, China Science Photon Chip (Haining) Technology Co., Ltd. |
14:55-15:15 | Advanced Bonding Technology for Optoelectronic Integration: Material Innovation and Device Integration | FuChao Liu, Deputy General Manager, iSABers Group Co., Ltd. |
15:15-15:35 | The Challenges of Next-Generation 3.2T Optical Modules for Optical and Electrical Chips | Kai Li, Technical Leader of High-Speed Optical Communication, Keysight Technologies |
15:35-15:55 | Tracking Progress of Silicon Photonics Technology | Richard Zhang, Business Development Manager, Intel |
15:55-16:15 | Enabling InP PICs for the CPO & AI Era: Lithography Enabled High-Volume Integration of Lasers and High-Bandwidth Modulators | Matthijs Agricola, Director, SMART Photonics |
16:15-16:35 | Market Analysis of Optical Interconnection in Computility Network | Carol Cao, Senior Analyst, LightCounting |
16:35-16:40 | Summary | End |
Full Professor of the Department of Electronic Engineering, Tsinghua University
Professor, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences
Vice General Manager, Suzhou Everbright Photonics Co., Ltd
Executive President of China Jiliang University, Qiushi Distinguished Professor/Dean of MOE's Joint lab of Photonics Technology at Zhejiang University
Senior Applications Engineer, MKS Newport
Staff Scientist, Silicon Austria Labs GmbH (SAL)
Deputy General Manager, iSABers Group Co., Ltd.
Technical Leader of High-Speed Optical Communication, Keysight Technologies
Business Development Manager, Intel
Director, SMART Photonics
Senior Analyst, LightCounting
High-Performance Optoelectronic Integrated Chips Frontier Technology Forum
Standard Price¥1200/Group Price¥960
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