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High-Performance Optoelectronic Integrated Chips Technology Forum
Time:2025-09-11
Venue:9C, 2nd Floor, Hall 9
Language:CN/EN

Organizer

China International Optoelectronic Exposition 

Photonics Society of Chinese Heritage (PSC)


Media Partner

C114、Optical Communication PRO



Against the backdrop of massive growth in computing infrastructure, the accelerated commercialization of AIGC, expansion of intelligent computing centers, and growth in the silicon photonic module market are boosting demand for optical chips. Silicon photonics, a key direction for chip development, is rapidly advancing. In February 2025, STMicroelectronics and AWS announced the upcoming mass production of the PIC100 chip, supporting 800G to 1.6T optical modules, showcasing silicon photonics potential. The PIC100 integrates discrete optoelectronic devices into a single chip, reducing power consumption by 30% with BiCMOS technology. This breakthrough is expected to address AI data interconnection bottlenecks.


However, optoelectronic chips face challenges, including multi-material integration, packaging technologies, and the need for sub-7nm processes. AI technology demands higher chip performance and energy efficiency, while optical networks require high-quality, high-capacity services. Optoelectronic chips need upgrades in reliability, stability, speed, design, packaging, and performance to meet transmission demands.


Against the aforementioned background, this conference will bring together experts and scholars from the field of optoelectronic chips, as well as representatives of upstream and downstream enterprises in the industry chain, to participate in the "High-Performance Optoelectronic Integrated Chips Technology Forum". The forum will delve into the latest technological advancements, application innovations, and future development directions of optoelectronic chips, promoting the sustainable growth of the optoelectronic chip industry.


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Conference agenda

High-Performance Optoelectronic Integrated Chips Technology Forum
TimeTopicsSpeakers
10:00-10:05Welcome SpeechHost
10:05-10:25Progress and Challenges of Integrated Optical Neural NetworksHongwei Chen, Tenured Professor at the Department of Electronic Engineering, Tsinghua University
10:25-10:45 Technical Iterations of Highly Integrated Silicon Photonics Control ICMurphy Mei, Director of Product Applications, Suzhou Legendsemi Technology Co., Ltd.
10:45-11:05Keynote SpeechLightwave Logic
11:05-11:25Photonic Chips and Parallel Photonic Computing Xie Peng, Professor, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences
11:25-11:45CPO Manufacturing SolutionsRudolf Kaiser, Technical Sales and CPO Business Development, ASMPT AMICRA GmbH
11:45-12:05Technologies and Challenges of Optical Chips in the CPO EraJohnny Wu, Vice General Manager, Suzhou Everbright Photonics Co., Ltd
12:05-13:30Lunch
13:30-13:35Welcome SpeechHost
13:35-13:55 High-performance Silicon Photonic Devices and ChipsDaoxin Dai, Executive President of China Jiliang University, Qiushi Distinguished Professor/Dean of MOE's Joint lab of Photonics Technology at Zhejiang University
13:55-14:15MKS Solutions for Silicon Photonics Huaihai Pan, Senior Applications Engineer, MKS Newport
14:15-14:35Scalable Sputtered Aluminum Nitride on Insulator for Integrated Photonics: Fabrication and Application OutlookThang Duy DAO, Staff Scientist, Silicon Austria Labs GmbH (SAL)
14:35-14:55Discussion on Heterogeneous Integration of Silicon PhotonicsYu Zhu, Co-CTO, China Science Photon Chip (Haining) Technology Co., Ltd.
14:55-15:15Advanced Bonding Technology for Optoelectronic Integration: Material Innovation and Device IntegrationFuChao Liu, Deputy General Manager, iSABers Group Co., Ltd.
15:15-15:35The Challenges of Next-Generation 3.2T Optical Modules for Optical and Electrical ChipsKai Li, Technical Leader of High-Speed Optical Communication, Keysight Technologies
15:35-15:55Tracking Progress of Silicon Photonics TechnologyRichard Zhang, Business Development Manager, Intel
15:55-16:15Enabling InP PICs for the CPO & AI Era: Lithography Enabled High-Volume Integration of Lasers and High-Bandwidth ModulatorsMatthijs Agricola, Director, SMART Photonics
16:15-16:35Market Analysis of Optical Interconnection in Computility NetworkCarol Cao, Senior Analyst, LightCounting
16:35-16:40SummaryEnd

Guest Introduction

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High-Performance Optoelectronic Integrated Chips Frontier Technology Forum


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