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High-Performance Optoelectronic Integrated Chips Technology Forum
Time:2025-09-11
Venue:9C, 2nd Floor, Hall 9
Language:CN

Organizer

China International Optoelectronic Exposition 

Photonics Society of Chinese Heritage (PSC)


Media Partner

C114、Optical Communication PRO



Against the backdrop of massive growth in computing infrastructure, the accelerated commercialization of AIGC, expansion of intelligent computing centers, and growth in the silicon photonic module market are boosting demand for optical chips. Silicon photonics, a key direction for chip development, is rapidly advancing. In February 2025, STMicroelectronics and AWS announced the upcoming mass production of the PIC100 chip, supporting 800G to 1.6T optical modules, showcasing silicon photonics potential. The PIC100 integrates discrete optoelectronic devices into a single chip, reducing power consumption by 30% with BiCMOS technology. This breakthrough is expected to address AI data interconnection bottlenecks.


However, optoelectronic chips face challenges, including multi-material integration, packaging technologies, and the need for sub-7nm processes. AI technology demands higher chip performance and energy efficiency, while optical networks require high-quality, high-capacity services. Optoelectronic chips need upgrades in reliability, stability, speed, design, packaging, and performance to meet transmission demands.


Against the aforementioned background, this conference will bring together experts and scholars from the field of optoelectronic chips, as well as representatives of upstream and downstream enterprises in the industry chain, to participate in the "High-Performance Optoelectronic Integrated Chips Technology Forum". The forum will delve into the latest technological advancements, application innovations, and future development directions of optoelectronic chips, promoting the sustainable growth of the optoelectronic chip industry.


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Conference agenda

High-Performance Optoelectronic Integrated Chips Technology Forum
TimeTopicsSpeakers
Host: Cun-Zheng Ning, Chair Professor and Dean, College of Integrated Circuits and Optoelectronic Chips, Shenzhen Technology University
10:00-10:05Welcome SpeechHost
10:05-10:25Keynote SpeechHongwei Chen, Tenured Professor at the Department of Electronic Engineering, Tsinghua University
10:25-10:45Keynote SpeechSuzhou Legendsemi Technology Co., Ltd.
10:45-11:05Keynote SpeechSiFotonics Technologies
11:05-11:25Photonic Chips and Parallel Photonic Computing Xie Peng, Professor, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences
11:25-11:45Keynote SpeechASMPT
11:45-12:05Keynote SpeechTBD
12:05-13:30Lunch
13:30-13:35Welcome SpeechHost
13:35-13:55Keynote SpeechDaoxin Dai, Dean of the School of Optoelectronic Science and Engineering, Zhejiang University
13:55-14:15MKS Solutions for Silicon Photonics Huaihai Pan, Senior Applications Engineer, MKS Newport
14:15-14:35Keynote SpeechSilicon Austria Labs
14:35-14:55Keynote SpeechChina Science Photon Chip (Haining) Technology Co., Ltd.
14:55-15:15Keynote SpeechManufacturers of packaging equipment(TBD)
15:15-15:35Keynote SpeechKeysight
15:35-15:55Keynote SpeechIntel
15:55-16:15Keynote SpeechDr. Vladimir Kozlov, CEO, LightCounting
16:15-16:20SummaryEnd

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High-Performance Optoelectronic Integrated Chips Frontier Technology Forum


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