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Development of Advanced Optical Technologies for Ultra-Multi-Card Intelligent Computing Clusters Forum
Time:2025-09-11
Venue:9B, 2nd Floor, Hall 9
Language:CN

Organizer

China International Optoelectronic Exposition

Optical Communication Committee of China Institute of Communications

Consulting Group of Transmission and Access Network of Telecommunication Science and Technology Committee of MIIT

Technology Standard Research Institute of China Academy of Information and Communications Technology


Guidance

China Mobile、China Telecom、China Unicom


Media Partner

C114、Optical Communication PRO





In 2025, domestic large models such as DeepSeek and Monica's AI agent Manus astonished the world, driving the popularization of intelligent computing applications. With the rapid expansion of AI model parameters, higher requirements were imposed on computing clusters, leading to the emergence of ultra-large-scale intelligent computing clusters with over 10,000 GPUs. However, these clusters faced technical challenges such as efficient interconnection. At the technical level, the packaging technology for high-speed optical modules evolved diversely, with 1.6T ultra-high-speed optical modules combined with advanced packaging processes enabling high-bandwidth, low-cost interconnectivity. TSMC's CPO technology accelerated its progress, and NVIDIA introduced optoelectronic integrated packaging network switches, promoting the widespread adoption of AI technology. All-optical switching technology (OCS) and coherent optical modules provided new technological pathways and development directions for DCN network architectures.

Nevertheless, optical interconnection technology within intelligent computing centers still faced challenges such as performance bottlenecks, transmission losses, and compatibility issues. Meanwhile, there was an urgent need for collaborative computing among intelligent computing centers, necessitating an upgrade of optical transmission technology. Although the ultra-high single-wave rate technology of over 800G improved single-wave transmission rates, issues arose during long-distance transmission. New technologies such as space division multiplexing and hollow-core fibers offered new ideas for increasing transmission capacity and reducing latency. However, optical transmission between intelligent computing centers still faced problems such as long-distance transmission losses, degraded signal quality, and inadequate network security. Additionally, differences in network architectures and technical standards led to challenges in interconnectivity and interoperability.

Against this backdrop, CIOE organized the "Development of Advanced Optical Technologies for Ultra-Multi-Card Intelligent Computing Clusters Forum", inviting experts from various fields to jointly explore the key technologies, innovative applications, and future development directions of optical interconnection within intelligent computing centers and optical transmission between them.


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