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Advanced Optical Technology Development for Ultra-Large-Scale Intelligent Computing Clusters Forum
Time:2025-09-11
Venue:9B, 2nd Floor, Hall 9
Language:CN/EN

Organizer

China International Optoelectronic Exposition

Optical Communication Committee of China Institute of Communications

Consulting Group of Transmission and Access Network of Telecommunication Science and Technology Committee of MIIT

Technology Standard Research Institute of China Academy of Information and Communications Technology


Guidance

China Mobile、China Telecom、China Unicom


Media Partner

C114、Optical Communication PRO





In 2025, domestic large models such as DeepSeek and Monica's AI agent Manus astonished the world, driving the popularization of intelligent computing applications. With the rapid expansion of AI model parameters, higher requirements were imposed on computing clusters, leading to the emergence of ultra-large-scale intelligent computing clusters with over 10,000 GPUs. However, these clusters faced technical challenges such as efficient interconnection. At the technical level, the packaging technology for high-speed optical modules evolved diversely, with 1.6T ultra-high-speed optical modules combined with advanced packaging processes enabling high-bandwidth, low-cost interconnectivity. TSMC's CPO technology accelerated its progress, and NVIDIA introduced optoelectronic integrated packaging network switches, promoting the widespread adoption of AI technology. All-optical switching technology (OCS) and coherent optical modules provided new technological pathways and development directions for DCN network architectures.


Nevertheless, optical interconnection technology within intelligent computing centers still faced challenges such as performance bottlenecks, transmission losses, and compatibility issues. Meanwhile, there was an urgent need for collaborative computing among intelligent computing centers, necessitating an upgrade of optical transmission technology. Although the ultra-high single-wave rate technology of over 800G improved single-wave transmission rates, issues arose during long-distance transmission. New technologies such as space division multiplexing and hollow-core fibers offered new ideas for increasing transmission capacity and reducing latency. However, optical transmission between intelligent computing centers still faced problems such as long-distance transmission losses, degraded signal quality, and inadequate network security. Additionally, differences in network architectures and technical standards led to challenges in interconnectivity and interoperability.


Against this background, this forum aims to bring together the strengths of industry, academia, and research. CIOE has invited internet service providers, data center equipment manufacturers, and core module component vendors to jointly host the "Advanced Optical Technology Development for Ultra-Large-Scale Intelligent Computing Clusters Forum" . The forum will focus on discussing key technologies, innovative applications, and future development directions for optical interconnects within AI data centers and optical transmission between these centers.


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Conference agenda

Advanced Optical Technology Development for Ultra-Large-Scale Intelligent Computing Clusters Forum
TimeTopicsSpeakers
Host: Qunbi Zhuge, Vice Dean and Professor of the School of Information and Electronic Engineering (School of Integrated Circuits), Shanghai Jiao Tong University
10:00-10:05OpeningHost
10:05-10:10Welcome SpeechXianneng Zou, Head of Tencent Network & Data Center
10:10-10:30Optics in the Age of AI: Where Do We Go From Here?Dr. Scott Wilkinson, Lead Analyst, Optical Components, Cignal AI)
10:30-10:50Optics Technology in New Scenarios and Applications in AIDCJun Luo, Distinguished Expert, Huawei Technologies Co., Ltd
10:50-11:10Fiber or Copper?Yibo Liang, Director, HiSilicon Optoelectronics Co.,Ltd.
11:10-11:30Technology and Development of Optical Networking in AI DatacenterEmma Wan, Optical Network Architect, Baidu.com Times Technology (Beijing) Co., Ltd
11:30-11:50Opportunities and Challenges of CPO in AI Optical InterconnectsFrank Zhu, Manager of R&D, Accelink
11:50-12:10AI Requirements for Scale, Reliability and Link MarginPer Hansen, Director, Product Line Management, Acacia (Cisco)
12:10-13:30Lunch
13:30-13:35OpeningHost
13:35-13:55Development Focus Areas and Prospects for High-Speed Optical Interconnect in the AI EraWenyu Zhao, Deputy Director, China Academy of Information and Communications Technology(CAICT), Institute of Technology and Standards Research
13:55-14:15Key Technologies and Future Development of Optical Interconnect in AIDCJames Zhang, Director of Business Development, Eoptolink Technology Inc., Ltd.
14:15-14:35Technical Evolution of High-Speed Interconnection in AI Computing Power NetworksChuanneng Luo, CTO, HGGenuine
14:35-14:55Optoelectronic Fusion Digital-Analog Mixed-Signal Processing for Optical InterconnectionMing Tang, School of Optical and Electronic Information / School of Future Technology, Huazhong University of Science and Technology
14:55-15:15Application of LPO/LRO in Next Generation Optical InterconnectionKevin Ouyang, Product Manager, Dongguan Luxshare Technology Co., Ltd.
15:15-15:35Speed Up the Testing on Next- Gen AI/ML Network InfrastructureHuijun Sha, SE Director, VIAVI
15:35-15:55Evolution and Insights on Optical Interconnection Technologies for Ultra-Large-Scale Intelligent Computing ClustersPeng Wang, Optical Network Architect, Alibaba Cloud Computing Co., Ltd.
15:55-16:15800G/1.6T for AI Data CenterYan Chen, Senior Director Product Marketing, Marvell
16:15-16:35Optical Interconnection Technology Routes and Application Scenario Analysis in AI ScenariosMr Liu Jingwei, Optical System Engineer, Ruijie Networks Co., Ltd.
16:35-16:55Evolution of AI Network Optical Interconnection TechnologySidong Fu, Optical Network Architect, Tencent
16:55-17:15Optical Challenges and Opportunities in CPOWilfried Noell, Chief Scientist, Focuslight Switzerland
17:15-17:20SummaryEnd

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