Striding Towards 800G~1.6T, to Build Ultra-Broadband Optical Connectivity for AI Computing Centers(Finished)
- Time：2024-09-11
- Venue：10C, 2nd Floor, Hall 10
- Language：CN
| Time | Topics | Speakers |
|---|---|---|
| 14:00-14:10 | Openning Speech | Vladimir Kozlov , CEO and Chief Analyst, LightCounting |
| 14:10-14:30 | Staying Ahead of Datacom's Xinghe Intelligent Network Trends, Starting a New Chapter of the Intelligent Optical Interconnection Era | Kevin Lv,VP & COO, Data Communications Product Line，Huawei Technologies Co., Ltd. |
| 14:30-14:50 | Challenges of Large Scale Intelligent Computing Cluster Network and Interconnection | Jing Liu,Network Architect Data Center,IFlytek Co., Ltd |
| 14:50-15:10 | Optical Interconnect Technology and Chip Architecture for 800G/1.6T Interconnection in Intelligent Computing Centers | Sidong Fu ,Optical Network Architect,Tencent |
| 15:10-15:30 | Opportunity and Challenge for HPN Optical Interconnection | Die Wan,Optical network architect，Baidu |
| 15:30-15:40 | Tea Break | |
| 15: 40-16:00 | Exploration into the Evolution of High-Speed Optical Interconnection Solutions for AI Computing Scenarios | HouKang,Senior Product Planning Manager，HiSilicon Optoelectronics |
| 16:00-16:20 | Adapting Optical Transceivers to the Unique Needs of AI Applications | Jim Theodoras,Vice President of Research and Development,Hgtech |
| 16:20-16:40 | Optical Technologies in High Density AI Networks | Tzu Hao Chow,Business Development Manager,Broadcom |
| 16:40-17:00 | Scaling Next Generation AI Compute with 800G/1.6T Optical Connectivity | Xi Wang,Vice President,Marvell |