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Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum(Finished)
Time:Sep 7
Site:9C, 2nd Floor, Hall 9
Language:
Co hosting
The International Optoelectronic Expo (CIOE)
National Optoelectronics Innovation Center
Photonics Society of Chinese Heritage (PSC)
Optica
Under the continuous promotion of new high broadband services and applications such as 5G Internet, cloud computing and big data, the evolution and upgrading of network business traffic in the telecom market of operators and optical interconnection networks of data centers all require upgrading of the rate requirements, design process, packaging form and performance technology of the optoelectronic chips used in them. At present, optoelectronic chips are accelerating into the post-Moore era, during which silicon optical chips combine the advantages of photons and electrons, break through the limitations of Moore's Law, and meet the explosive computing power needs brought by AI industry and cloud computing. Silicon optical chips are expected to carry high-speed data transmission in large data centers in the next three years. In 2023, with the increasing demand for 400G/800G/1.6T optical modules, the combination of thin film lithium niobate chip and silicon optical process has become the technical direction of the industry.
At the same time, as a microprocessor that can process all kinds of digital signals quickly and in real time, DSP chip has gradually penetrated into communication, computer, consumer electronics and other fields, especially in the digital age, DSP chip market scale has gradually grown. However, DSP has always been a "bottleneck" problem restricting the development of national optical communication industry. Due to the relatively closed ecology of DSP chip industry and high intellectual property barriers, there has not been a mature domestic program that can directly replace it. At present, the market share of domestic DSP chip manufacturers is still small, but the downstream market with strong demand is calling for domestic chip products with good cost performance and independent intellectual property rights. It is urgent to break the foreign technology monopoly and improve the self-supply rate of domestic DSP chip.
At present, domestic optical chips of 10G and below have achieved a high global market share, but the localization rate of 10G 1577 EML and 25G and above optical communication chips is not more than 15%. In the face of foreign technology blockade, how to deal with the domestic optical chip market? How to effectively overcome the optical chip integration technology, wafer manufacturing, chip testing and packaging technology, optoelectronic chip industry needs to face together, and join hands to discuss. Therefore, CIOE will invite the upstream and downstream enterprises of optoelectronic chips and optical chip industry experts to participate in the "Optoelectronic chip Design and Manufacturing, Packaging Technology Forum" for in-depth communication and discussion.
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Conference agenda

Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum(Finished)
TimeSpeech titleIntended Guests
10:00-10:05OpeningHOST: Yang Yue, Professor of the School of Information and Communications Engineering, Xi'an Jiaotong University
10:05-10:30White Paper on Optical Sensing Technology and Key Devices for Integrated communication, sensing and computingBingbing Wu, chief engineerp, China Academy of Information and Communication Technology (CAICT)
10:30-10:50Single-channel 106Gbps VCSEL for Supercomputing CentersJiaxing Wang, VP R & D, Berxel Photonics Co.,Ltd
10:50-11:10Silicon Photonics Technologies Application and Industrialization in 25G/50G PON, 800G DC interconnection and Coherent-Lite MarketsDong Pan, CEO, SiFotonics Technologies Co.,Ltd
11:10-11:30The Application of Dicing Saw Machine in the Field of OptoelectronicsMengJie Wang, Project Menager, Shenzhen Han's Semiconductor Equipment Technology Co., Ltd.
11:30-11:55Trends in Silicon Photonics, Linear Drive Pluggable and Co-Packaged OpticsTom William, Senior Analyst, LightCounting Market Research
11:55-13:30Lunch
HOST: Yang Yue, Professor of the School of Information and Communications Engineering, Xi'an Jiaotong University
13:30-13:35OpeningHOST: Yang Yue, Professor of the School of Information and Communications Engineering, Xi'an Jiaotong University
13:35-14:00Ethernet/OTN dual-rate applications of 100G/400G based on 100G PAM4Ph.D Shikui Shen, Expert of China Unicom
14:00-14:20The Evolution and Trends of Optoelectronic Chip Packaging in the AI EraLimin Zhou, General Manager, MRSI Automation(Shenzhen)Co.,Ltd
14:20-14:45Integrated Optical Modulation Chip for Pluggable Optical ModulesYang Yue, Yang Yue, Professor of the School of Information and Communications Engineering, Xi'an Jiaotong University
14:45-15:05Exploration of VCSEL customization servicesTony.Xiang, VP of R&D, Toptrans (Suzhou) Co.,Ltd
15:05-15:25800G LPO Based on TFLN ModulatorPims Nie, Director of AOI
15:25-15:45Silicon Photonics Hybrid Integration, Enabling Technology for Optical Communication and Optical SensingEdward Shu, VP China, DenseLight Semiconductors
15:45-16:05RF test instrument application in optoelectronic component testingGuoying Fu, Application Manager of Rohde & Schwarz (China)Technology Co.,Ltd
16:05-16:25Intel Silicon Photonics device and Optical Compute InterconnectHongdi Mou, Senior Application Engineer, Intel
HOST: Yang Yue, Professor of the School of Information and Communications Engineering, Xi'an Jiaotong University

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