Under the continuous promotion of new high broadband services and applications such as 5G Internet, cloud computing and big data, the evolution and upgrading of network business traffic in the telecom market of operators and optical interconnection networks of data centers all require upgrading of the rate requirements, design process, packaging form and performance technology of the optoelectronic chips used in them. At present, optoelectronic chips are accelerating into the post-Moore era, during which silicon optical chips combine the advantages of photons and electrons, break through the limitations of Moore's Law, and meet the explosive computing power needs brought by AI industry and cloud computing. Silicon optical chips are expected to carry high-speed data transmission in large data centers in the next three years. In 2023, with the increasing demand for 400G/800G/1.6T optical modules, the combination of thin film lithium niobate chip and silicon optical process has become the technical direction of the industry.
At the same time, as a microprocessor that can process all kinds of digital signals quickly and in real time, DSP chip has gradually penetrated into communication, computer, consumer electronics and other fields, especially in the digital age, DSP chip market scale has gradually grown. However, DSP has always been a "bottleneck" problem restricting the development of national optical communication industry. Due to the relatively closed ecology of DSP chip industry and high intellectual property barriers, there has not been a mature domestic program that can directly replace it. At present, the market share of domestic DSP chip manufacturers is still small, but the downstream market with strong demand is calling for domestic chip products with good cost performance and independent intellectual property rights. It is urgent to break the foreign technology monopoly and improve the self-supply rate of domestic DSP chip.

At present, domestic optical chips of 10G and below have achieved a high global market share, but the localization rate of 10G 1577 EML and 25G and above optical communication chips is not more than 15%. In the face of foreign technology blockade, how to deal with the domestic optical chip market? How to effectively overcome the optical chip integration technology, wafer manufacturing, chip testing and packaging technology, optoelectronic chip industry needs to face together, and join hands to discuss. Therefore, CIOE will invite the upstream and downstream enterprises of optoelectronic chips and optical chip industry experts to participate in the "Optoelectronic chip Design and Manufacturing, Packaging Technology Forum" for in-depth communication and discussion.