In the era of global informatization and intelligence, optoelectronic chips as core components in the field of information technology, are receiving significant attention from the global scientific and industrial communities. As the core components of optical networks, optoelectronic chips urgently need to be upgraded in terms of speed, design processes, packaging formats, and performance technical indicators to meet the growing demand for information transmission. Nowadays, optoelectronic chips are accelerating into the post-Moore's Law era. A primary technological trend in this era is how to achieve computational power of chips increases at the pace of Moore's Law through disruptive innovations in integrated circuit design, new materials and packaging forms, and devices. To achieve this goal, breakthroughs and innovations in related technologies are particularly urgent.

Therefore, CIOE will sincerely invite upstream and downstream enterprises of the optoelectronic chips and industry experts to participate in the "Optoelectronic Integrated Chip Design, Manufacturing, Packaging Technology Forum" for in-depth exchanges and discussions. The goal is to promote the sustainable development of the optoelectronic chip industry and contribute more to the global process of informatization and intelligence.