2026 marks the start of China's 15th Five-Year Plan and a critical period for its semiconductor industry to achieve self-sufficiency. As Moore's Law approaches physical limits, manufacturing is shifting from simply shrinking linewidths to multi-dimensional innovation. Laser technology, with its high precision and low thermal damage, has evolved from a supporting tool to a core engine across the entire chipmaking chain.

In front-end processes, excimer laser annealing and laser doping are essential for advanced nodes. In inspection, ultrafast lasers enable high-throughput nanoscale defect detection. In advanced packaging, laser micro-processing—such as stealth dicing, laser-assisted bonding, and TGV drilling—supports 3D stacking, Chiplet, and heterogeneous integration, enabling high-density interconnects and high reliability.

The "Laser Technology Empowering Semiconductor Manufacturing Forum" brings together industry leaders and experts to explore the latest breakthroughs, challenges, and future directions of laser technology in semiconductor manufacturing.