As a core strategic breakthrough in the post-Moore era, photonics-electronics integration is reshaping the global industrial landscape amid the booming trillion-scale market, ushering the optical communications industry into a new revolution. In 2026, the mainstream technological evolution roadmap of optical communications has become well-defined. Silicon photonics is accelerating the substitution of traditional EML solutions, with its penetration rate rising sharply in high-end products including 800G and 1.6T optical modules. Silicon photonic heterogeneous integration and thin-film lithium niobate (TFLN) technologies are achieving rapid maturity. China’s first 6-inch TFLN photonic chip pilot line has secured breakthrough mass production capability, delivering a modulation bandwidth beyond 110 GHz that meets international advanced benchmarks.

Remarkable milestones have also been achieved in cutting-edge optical computing. Tsinghua University’s fully analog optoelectronic intelligent computing chip delivers system-level energy efficiency over four million times higher than that of prevailing high-performance chips. Huazhong University of Science and Technology's all-optical nonlinear deep neural network chip achieves an ultra-low latency of 172 picoseconds, empowering the ongoing computing revolution with unprecedented momentum.

Core packaging technologies are evolving from conventional pluggable optical modules to co-packaged optics (CPO). By integrating optical engines with compute/switch ASICs on a unified packaging substrate, CPO shortens interconnection lengths to 1–2 cm, reduces transmission latency to the picosecond level, cuts power consumption by 80%, and enhances bandwidth density by fivefold. With continuous technological advancement, CPO is gaining traction in intra-cabinet optical interconnections, and will further enable optical upgrading at in-server, board-level and chip-level dimensions. Large-scale deployment in scale-out data center switches and GPUs is projected for 2026–2027. 

Nevertheless, the advancement of photonics-electronics integration still faces notable challenges. Technically, further breakthroughs are imperative in optical component dimensional control, thermal management and cost optimization. The compatibility between high-density photonic integration and electronic circuitry requires systematic co-design, while a comprehensive theoretical framework bridging quantum optics and classical optoelectronic integration remains to be established. From the industrial chain perspective, high-end optical chips and key manufacturing equipment rely heavily on imports with low localization coverage. Critical upstream materials — such as silicon photonic chips and Faraday rotators — are confronted with periodic supply constraints. Fragmented process platforms and a generational gap in core packaging capabilities still exist compared with global industry leaders.

Based on this background, the Optoelectronic Integration Technology and Industrial Development Forum focuses on core technological breakthroughs and full-value-chain collaborative innovation across the photonics-electronics ecosystem. It will conduct in-depth discussions on the latest progress in silicon photonic integration, co-packaged optics, optical computing chips and key optical components, while analyzing innovative application pathways in pivotal scenarios including intelligent computing interconnections, quantum computing, optical computing, automotive optical communications and industrial control. The forum aims to drive photonics-electronics integration from isolated technological breakthroughs toward full-industry-chain maturity, and inject core impetus into the high-quality development of the digital economy worldwide.