Organizer
The Committee of Optical Manufacturing Technologies, The Chinese Optical Society
Shanghai Engineering Research Center of Ultra-Precision Optical Manufacturing, Fudan University
China International Optoelectronic Expo (CIOE)
Cooperation
Beijing Institute of Technology
In the era of intelligent manufacturing, optical detection plays a vital role. In the industrial manufacturing process, optical inspection ensures the stability of product quality, accuracy and performance, laying the foundation for the advent of the era of intelligent manufacturing. With the continuous expansion of the global semiconductor industry capacity, the demand for semiconductor equipment has shown a rapid growth trend, which has driven the market demand for testing and measurement equipment. As the world's largest semiconductor equipment market, China's dependence on test and measurement equipment will continue to increase. The mainstream semiconductor process is developing to a smaller scale, from 28nm, 14nm to 10nm, 7nm progress, some advanced semiconductor manufacturers have achieved the mass production of 5nm process and began to develop 3nm process. New technologies such as 3D FinFET transistors and 3D NAND have gradually become the mainstream of the industry.
However, with the continuous progress of the process, the number of product process steps increases, the microstructure is complicated, and the production cost increases exponentially. In order to obtain higher wafer yield, the process consistency between wafers and on the same wafer must be strictly controlled. This undoubtedly puts forward higher requirements for quality control. In the future, inspection and measurement equipment will need to be continuously optimized on key indicators such as sensitivity, accuracy, stability, and throughput to ensure that each process falls within the allowable process window, thus ensuring the smooth and continuous operation of the entire production line. This demand has promoted the continuous innovation and development of related equipment technology, but also brought great challenges and opportunities to the field of quality control.
Time | Topics | Speakers |
---|---|---|
Session 1: Optical Semiconductor Testing | ||
Host: Min Xu, Professor, Shanghai Engineering Research Center of Ultra-Precision Optical Manufacturing, Fudan University | ||
10:00-10:05 | Opening | |
10:05-10:25 | AI Powered High Sensitivity Metrology Boost Yield | Xuena Zhang, Chairwoman、CTO, Shenzhen Angstrom Semiconductor Technology Co., Ltd. |
10:25-10:45 | High-Performance Manufacture and Optical Instrument | Min Xu, Professor, Shanghai Engineering Research Center of Ultra-Precision Optical Manufacturing, Fudan University. |
10:45-11:05 | Application of Machine Vision in The Dimensional Management of Semiconductor Industry | Zhiwei Wang, Metrology Dept Chief Product Officer, TZTEK Technology Co., Ltd. |
11:05-11:25 | Defect Inspection Technologies for Compound Semiconductors | Zhouling Wu, Chief Scientist, ZC Optoelectronic Technologies. LTD. |
11:25-11:45 | Ultra High Precision Semiconductor Inspection Lens | Julia Zhao, Chief Technology Officer, Quancool Intelligent Technology Co., Ltd. |
Lunch&Break | ||
Session 2: Spectral Detection Technology | ||
Host:Nan Zhang, Professor, Beijing Institute of Technology | ||
14:00-14:05 | Opening | |
14:05-14:25 | Metaoptics Enabled Multi-Dimensional Imaging Detection | Fei Yi, Professor, Huazhong University of Science and Technology, School of Optical and Electronic Information. |
14:25-14:45 | Multi-Dimensional Light Field Detection: From Spectrum to Depth Spectrum | Jing Cui, General Manager, Ideaoptics Inc. |
14:45-15:05 | Specim Hyperspectral Imaging Technology and Related Application Scenarios | Austin Zhang, China Area Sales Manager, Specim. |
15:05-15:25 | On-Chip Computational Hyperspectral Imaging with High Spatial and Temporal Resolution | Liheng Bian, Professor, Beijing Institute of Technology. |
15:25-15:45 | Take Light as A Ruler, Measure Everything - Let The Machine See The World | Yaoliang Zhong, Regional Manager, South China, Shining 3D Tech Co., Ltd. |
15:45-16:05 | Innovative Black Silicon Photodiode Technology and Its Potential Applications | Dr. Fan Ji, Program Manager, ElFys, Inc. |
16:05-16:25 | Development and Application Prospects of On-Chip Spectral Imaging Technology | Wayne Wang, Founder/Chairman/CEO, Beijing Seetrum Technology Co., Ltd. |
16:25-16:45 | Bridging UV-VIS to NIR for Semiconductor Metrology | Jamie Zhou, Associate Product Manager, Carl Zeiss (Shanghai) Co., Ltd. |
Professor, Shanghai Engineering Research Center of Ultra-Precision Optical Manufacturing, Fudan University
Chairwoman、CTO, Shenzhen Angstrom Semiconductor Technology Co., Ltd
Metrology Dep Chief Product Officer, TZTEK Technology Co., Ltd
Chief Scientist, ZC Optoelectronic Technologies. LTD.
Chief Technology Officer, Quancool Intelligent Technology Co., Ltd
Professor, Beijing Institute of Technology
Professor, Huazhong University of Science and Technology, School of Optical and Electronic Information
General Manager, Ideaoptics Inc
China Area Sales Manager, Specim
Professor, Beijing Institute of Technology
Regional Manager, South China, Shining 3D Tech Co., Ltd
Program Manager, ElFys, Inc
Founder/Chairman/CEO, Beijing Seetrum Technology Co., Ltd
Associate Product Manager, Carl Zeiss (Shanghai) Co., Ltd